SN74LVC1G126YEPR datasheet, PDF

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SN74LVC1G126YEPR: DescriptionLVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PBGA5, DSBGA-5; Categorylogic logic; File Size1MB，17 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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SN74LVC1G126YEPR Overview

LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PBGA5, DSBGA-5

SN74LVC1G126YEPR Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	BGA
package instruction	DSBGA-5
Contacts	5
Reach Compliance Code	unknown
series	LVC/LCX/Z
JESD-30 code	R-PBGA-B5
JESD-609 code	e0
length	1.4 mm
Logic integrated circuit type	BUS DRIVER
Humidity sensitivity level	1
Number of digits	1
Number of functions	1
Number of ports	2
Number of terminals	5
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Output characteristics	3-STATE
Output polarity	TRUE
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
propagation delay (tpd)	8 ns
Maximum seat height	0.5 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	0.9 mm

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SCES224M − APRIL 1999 − REVISED JUNE 2005

SN74LVC1G126

SINGLE BUS BUFFER GATE

WITH 3 STATE OUTPUT

description/ordering information (continued)

NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a

pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the

driver.

This device is fully specified for partial-power-down applications using I

off

. The I

off

circuitry disables the outputs,

preventing damaging current backflow through the device when it is powered down.

FUNCTION TABLE

INPUTS

OUTPUT

logic diagram (positive logic)

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

†

Supply voltage range, V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V

Input voltage range, V

(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V

Voltage range applied to any output in the high-impedance or power-off state, V

(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 6.5 V

Voltage range applied to any output in the high or low state, V

(see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V

+ 0.5 V

Input clamp current, I

< 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA

Output clamp current, I

< 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA

Continuous output current, I

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±50

Continuous current through V

or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±100

Package thermal impedance,

(see Note 3): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W

DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252°C/W

DRL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142°C/W

YEA/YZA package . . . . . . . . . . . . . . . . . . . . . . . . . . . 154°C/W

YEP/YZP package . . . . . . . . . . . . . . . . . . . . . . . . . . . 132°C/W

Storage temperature range, T

stg

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. The value of VCC is provided in the recommended operating conditions table.

3. The package thermal impedance is calculated in accordance with JESD 51-7.

POST OFFICE BOX 655303

•

DALLAS, TEXAS 75265

SN74LVC1G126YEPR Related Products

	SN74LVC1G126YEPR	74LVC1G126DBVRG4	SN74LVC1G126DCKR	SN74LVC1G126DCKT	SN74LVC1G126YZPR	SN74LVC1G126YZAR	SN74LVC1G126YEAR	SN74LVC1G126DBVR	SN74LVC1G126DBVT
Description	LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PBGA5, DSBGA-5	LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5, GREEN, PLASTIC, SOT-23, 5 PIN	LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5, GREEN, PLASTIC, SC-70, 5 PIN	LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5, GREEN, PLASTIC, SC-70, 5 PIN	LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, BGA5, GREEN, DSBGA-5	LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PBGA5, GREEN, MO-211EA, DSBGA-5	LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PBGA5, MO-211EA, DSBGA-5	LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5, GREEN, PLASTIC, SOT-23, 5 PIN	LVC/LCX/Z SERIES, 1-BIT DRIVER, TRUE OUTPUT, PDSO5, GREEN, PLASTIC, SOT-23, 5 PIN
Is it lead-free?	Contains lead	Lead free	Lead free	Lead free	Lead free	Contains lead	Lead free	Lead free	Lead free
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
Parts packaging code	BGA	SOT-23	SOIC	SOIC	BGA	DSBGA	DSBGA	SOT-23	SOT-23
package instruction	DSBGA-5	LSSOP,	TSSOP,	TSSOP,	GREEN, DSBGA-5	GREEN, MO-211EA, DSBGA-5	MO-211EA, DSBGA-5	LSSOP,	LSSOP,
Contacts	5	5	5	5	5	5	5	5	5
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow	unknow
series	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-PBGA-B5	R-PDSO-G5	R-PDSO-G5	R-PDSO-G5	R-XBGA-B5	R-PBGA-B5	R-PBGA-B5	R-PDSO-G5	R-PDSO-G5
JESD-609 code	e0	e4	e1	e4	e1	e1	e0	e4	e4
length	1.4 mm	2.9 mm	2 mm	2 mm	1.4 mm	1.4 mm	1.4 mm	2.9 mm	2.9 mm
Logic integrated circuit type	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER	BUS DRIVER
Humidity sensitivity level	1	1	1	1	1	1	1	1	1
Number of digits	1	1	1	1	1	1	1	1	1
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	2	2	2	2	2	2	2	2	2
Number of terminals	5	5	5	5	5	5	5	5	5
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Output polarity	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE	TRUE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	LSSOP	TSSOP	TSSOP	VFBGA	VFBGA	VFBGA	LSSOP	LSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260	260
propagation delay (tpd)	8 ns	8 ns	8 ns	8 ns	8 ns	8 ns	8 ns	8 ns	8 ns
Maximum seat height	0.5 mm	1.45 mm	1.1 mm	1.1 mm	0.5 mm	0.5 mm	0.5 mm	1.45 mm	1.45 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	3.3 V	3.3 V	3.3 V	3.3 V	1.8 V	1.8 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	NICKEL PALLADIUM GOLD	TIN SILVER COPPER	NICKEL PALLADIUM GOLD	TIN SILVER COPPER	TIN SILVER COPPER	TIN LEAD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
Terminal form	BALL	GULL WING	GULL WING	GULL WING	BALL	BALL	BALL	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.95 mm	0.65 mm	0.65 mm	0.5 mm	0.5 mm	0.5 mm	0.95 mm	0.95 mm
Terminal location	BOTTOM	DUAL	DUAL	DUAL	BOTTOM	BOTTOM	BOTTOM	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	0.9 mm	1.6 mm	1.25 mm	1.25 mm	0.9 mm	0.9 mm	0.9 mm	1.6 mm	1.6 mm
Is it Rohs certified?	incompatible	conform to	-	-	conform to	conform to	incompatible	conform to	conform to

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