IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP48,.6 |
| Reach Compliance Code | unknown |
| bit size | 32 |
| JESD-30 code | R-XDIP-T48 |
| JESD-609 code | e0 |
| Number of terminals | 48 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP48,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| speed | 10 MHz |
| surface mount | NO |
| technology | MOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
| NS32016D-10 | NS32016D10-MSP | NS32016N-10 | |
|---|---|---|---|
| Description | IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,CERAMIC | IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,CERAMIC | IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP48,.6 | DIP, DIP48,.6 | DIP, DIP48,.6 |
| Reach Compliance Code | unknown | unknown | unknown |
| bit size | 32 | 32 | 32 |
| JESD-30 code | R-XDIP-T48 | R-XDIP-T48 | R-PDIP-T48 |
| JESD-609 code | e0 | e0 | e0 |
| Number of terminals | 48 | 48 | 48 |
| Maximum operating temperature | 70 °C | 85 °C | 70 °C |
| Package body material | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP48,.6 | DIP48,.6 | DIP48,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| speed | 10 MHz | 10 MHz | 10 MHz |
| surface mount | NO | NO | NO |
| technology | MOS | MOS | MOS |
| Temperature level | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
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