NS32016D10-MSP datasheet, PDF - EEWORLD Datasheet

NS32016D10-MSP: DescriptionIC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,CERAMIC; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，64 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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NS32016D10-MSP Overview

IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,CERAMIC

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP48,.6
Reach Compliance Code	unknown
bit size	32
JESD-30 code	R-XDIP-T48
JESD-609 code	e0
Number of terminals	48
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP48,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Filter level	MIL-STD-883 Class B (Modified)
speed	10 MHz
surface mount	NO
technology	MOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

	NS32016D10-MSP	NS32016D-10	NS32016N-10
Description	IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,CERAMIC	IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,CERAMIC	IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP48,.6	DIP, DIP48,.6	DIP, DIP48,.6
Reach Compliance Code	unknown	unknown	unknown
bit size	32	32	32
JESD-30 code	R-XDIP-T48	R-XDIP-T48	R-PDIP-T48
JESD-609 code	e0	e0	e0
Number of terminals	48	48	48
Maximum operating temperature	85 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP
Encapsulate equivalent code	DIP48,.6	DIP48,.6	DIP48,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified
speed	10 MHz	10 MHz	10 MHz
surface mount	NO	NO	NO
technology	MOS	MOS	MOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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