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NS32016N-10

Description
IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,PLASTIC
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size4MB,64 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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NS32016N-10 Overview

IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,PLASTIC

NS32016N-10 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDIP, DIP48,.6
Reach Compliance Codeunknown
bit size32
JESD-30 codeR-PDIP-T48
JESD-609 codee0
Number of terminals48
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP48,.6
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
speed10 MHz
surface mountNO
technologyMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC

NS32016N-10 Related Products

NS32016N-10 NS32016D-10 NS32016D10-MSP
Description IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,PLASTIC IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,CERAMIC IC,MICROPROCESSOR,32-BIT,MOS,DIP,48PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible
Maker Texas Instruments Texas Instruments Texas Instruments
package instruction DIP, DIP48,.6 DIP, DIP48,.6 DIP, DIP48,.6
Reach Compliance Code unknown unknown unknown
bit size 32 32 32
JESD-30 code R-PDIP-T48 R-XDIP-T48 R-XDIP-T48
JESD-609 code e0 e0 e0
Number of terminals 48 48 48
Maximum operating temperature 70 °C 70 °C 85 °C
Package body material PLASTIC/EPOXY CERAMIC CERAMIC
encapsulated code DIP DIP DIP
Encapsulate equivalent code DIP48,.6 DIP48,.6 DIP48,.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified
speed 10 MHz 10 MHz 10 MHz
surface mount NO NO NO
technology MOS MOS MOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
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