Piezoelectronic Ceramic Filters
Lead type
10.7MHz
FFE series
Issue date:
August 2007
• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
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Ceramic Filters
FFE Series(Lead)
FEATURES
• To small dispersion of center frequency in our products, devices
in a single rank can be supplied. Consequently, adjustment-free
IC circuits are easy produced.
• Because of the small characteristic dependence on temperature,
IF circuit can be made to have a highly stabilized
temperature(Temperature coefficient of center frequency :
±50ppm/°C).
• The size and weight are small and light.
• Because of the small loss dispersion as well as the low loss
characteristics, a product of high sensitivity can be
manufactured in the form of set.
• Ammo packing is available for various automatic insert machine
(1800pieces/box). Short lead type and L-bend lead type are also
available, please contact TDK.
• The products do not contain lead at solder of internal joint and
solder plating of lead wire. You can use both Pb free solder (Sn-
3Ag-0.5Cu) and Sn-Pb eutectic solder on your production.
SHAPES AND DIMENSIONS
Color code
7.0max.
8.0max.
Date code
4.0max.
Conformity to RoHS Directive
PRODUCT IDENTIFICATIONS
FFE 1070 MA 11 U X L
(1)
(2)
(3) (4) (5) (6) (7)
(1) Series name
FFE
Ceramic filter
(2) Center frequency
1060
1070
1080
10.600MHz
10.700MHz
10.800MHz
(3) 3dB band width(BW3)
MA
NA
MS
MJ
280±50kHz
230±50kHz
180±40kHz
150±40kHz
(4) Center frequency tolerance
10
11
±20kHz
±30kHz
(5) Packaging style for product type
Shapes dimensions
Symbol (mm)max.
Width
Height
U
7.0
7.0
S
8.0
7.0
F
8.0
7.0
H
7.0
7.0
R
8.0
7.0
T
8.0
7.5
Packaging
style
Bulk
Bulk
Bulk
Ammo pack
Ammo pack
Ammo pack
BW3 symbol
MA NA
MS MJ
107MS
TDK
5.0+0.5, –1
3
2
1
(Out) (GND) (In)
2.5±0.3
2.5±0.3
ø0.55±0.1
Dimensions in mm
(6) Electrical characteristics
Symbol
Classification
Low loss
Standard
Standard
Custom made
BW3 symbol
MA
NA
MS
MJ
CIRCUIT DIAGRAM
1
3
A
B
X
Others
(7) Lead length
2
MEASUREMENT CIRCUIT
NWA
50Ω
R
1
1
DUT
2
50Ω
3
R
2
NWA
V
L
M
Others
5.0+0.5, –1.0mm Taping (Ammo pack)
3.0±0.5mm
Custom made
R
1
=R
2
=280Ω
Reference Level: Short condition between 1 and 3 without DUT.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• All specifications are subject to change without notice.
002-01 / 20070815 / ef12_ffe.fm
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ELECTRICAL CHARACTERISTICS
Part No.
Standard type
FFE1070MA11UXL
FFE1070NA11UXL
FFE1070MS11SBL
FFE1070MJ11FBL
Low loss type
FFE1070MA11UAL
FFE1070NA11UAL
FFE1070MS11SAL
FFE1070MJ11FAL
Group delay time control type
FFE1070NA10UGL
∗
FFE1070MS10SGL
∗
∗
3dB band width
(kHz)
280±50
230±50
180±40
150±40
280±50
230±50
180±40
150±40
230±50
180±40
20dB band width
(kHz)max.
600
570
520
400
600
570
520
400
570
520
Insertion loss
(dB)max.
6.0
6.0
7.0
10.0
5.0
4.5
5.0
7.0
6.0
7.0
SPR attenuation
(dB)min.
35
35
35
35
35
35
35
35
35
35
Group delay time: 0.50max.
RELIABILITY AND TEST CONDITIONS
The following test items are satisfied.
(1) Center frequency: Within ±30kHz
(2) 3dB band width: Within ±20kHz
(3) 20dB band width: Within ±30kHz
(4) Insertion loss: Within ±2dB
(5) Attenuation: 25dB min.
Test items
Low temperature
storage characteristics
High temperature
storage characteristics
Test conditions
Temperature: –40±3°C
Time: 100h
Temperature: +85±2°C
Time: 100h
Loading: DC.5V(between in/out and
ground terminal)
Humidity: 90 to 95(%)RH
Temperature: 60±2°C
Time: 100h
–40°C (30min), 85°C (30min) x 5 cycles
Solder temperature: peak 260°C, 10s flow
Drop 3 times onto a hard wooden board
from a height of 1m
Frequency: 10
⇔
55
⇔
10Hz/Ampli-
tude: 1.5mm
X, Y and Z directions for 2h each
SOLDERABILITY
The lead wires are adopted Pb free plating wire to apply Pb free
soldering. You can also use current Sn-Pb eutectic solder.
Test conditions
With Rosin-methanol 25% by weight, dip in Sn-Pb
eutectic solder bath at 230±5°C for 3±0.5sec. or
Pb free solder(Sn-3Ag-0.5Cu) bath at 245±2°C
for 3±0.2sec.
Test result
95% minimum of
surface should be
covered by new solder.
RECOMMENDED SOLDERING CONDITIONS
This is the fit product for flow soldering.
FLOW SOLDERING CONDITION
Heat-resistant temperature
Heat-resistant time
Number of times
260±5°C
10±1sec.
1time
Humidity resistance
Thermal shock
Soldering heat resistance
Drop
Vibration
• All specifications are subject to change without notice.
002-01 / 20070815 / ef12_ffe.fm
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