Low Profile Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifier
MB05F
thru
M B10F
μ
VOLTAGE - 50 TO 1000 VOLTS
CURRENT - 0.5 AMPERES
FEATURES
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MBF
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Low profile space
Ideal for automated placement
Glass passivated chip junction
Low forward voltage drop
Low leakage current
High forward surge capability
High temperature soldering：
260℃/10 seconds at terminals
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
MECHANICAL DATA
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Case: MBF Molded plastic
over glass passivated chip
Terminals: Solder plated, solderable per
J-STD-002B and JESD22-B102D
Polarity: Polarity symbols marked on body
MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS
(T
A
= 25 C unless otherwise noted)
°
Symbol MB05F MB1F MB2F MB4F MB6F MB8F MB10F UNIT
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward output rectified
current at T
A
=30℃
-on glass-epoxy P.C.B
(NOTE 1)
-on aluminum substrate
(NOTE 2)
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load(JEDEC Method)
Maximum instantaneous forwad voltage drop
per leg at 0.4A
Maximum DC reverse current at T
A
= 25
℃
rated DC blocking voltage per leg T
A
= 125℃
Typical junction capacitance per leg at 4.0 V ,1MHz
(NOTE 1)
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
C
J
R
θJA
R
θJA
R
θJL
50
35
50
100 200 400 600 800 1000
70
140 280 420 560
700
100 200 400 600 800 1000
0.5
0.8
35
1
5.0
100
13
85
70
20
V
V
V
A
A
V
μA
pF
℃/
W
℃
Thermal resistance per leg
(NOTE 2)
(NOTE 1)
T
J
, T
STG
Operating junction and storage temperature range
–55
to +150
NOTE1
:On glass epoxy P.C.B. mounted on 0.05×0.05″(1.3×1.3mm) pads
NOTE2
:On aluminum substrate P.C.B. with an area of 0.8″×0.8″(20×20mm) mounted
on 0.05×0.05″(1.3×1.3mm) solder pad
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