• Extended guide rails enable accurate and easy card
insertion
• Single row surface mount solder tails facilitate auto
placement and IR soldering
• Optional 2 mm board standoff enables board
population
• Meets CFA standards for known compatibility and
reliability
• Optional ejector and card retainer can be purchased
pre-assembled or separately
• Integral side solder tab with card grounding feature
and also prevent the card from ‘flying’ out of header
during ejection
• See the Regulatory Information Appendix (RIA) in
the “RoHS compliance” section of
www.3Mconnector.com for compliance
information (RIA E1 & C1 apply)
Date Modified: May 12, 2010
TS-2329-A
Sheet 1 of 4
Physical
Material: High Temperature Thermoplastic
Flammability: UL 94V-0
Color: Beige
Insulation:
Contact:
Terminal Plating:
Material: Copper Alloy
Underplating: 80 µ" [2.03 µm] Min. Nickel
Wiping Area: 15 µ” or 30 µ” [0.38 – 0.76 µm] Min. Gold
Solder Tail: 100 µ” [2.54 µm] Min. Matte Tin
Electrical
Insulation Resistance:
10
3
MΩ at 500 V
AC
Withstanding Voltage:
500 V
AC
for 1 minute
Current Rating:
1.5 A per pin
Environmental
Temperature Rating:
-40°C to 85°C
Process Temperature Rating:
Max. 260°C (per J-STD-020C)
Moisture Sensitivity Level:
1 (per J-STD-020C)
3
Electronic Solutions Division
Interconnect Solutions
http://www.3Mconnector.com
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
Connector for CFast
™
Card
40.16±0.1
[1.581±0.004]
7G24 Series
( )
7.62
[.300]
1.27
[.050](22X)PITCH
0.45±0.05
[.018±0.002]
B
S1
( )
( )
39.23
[1.545]
26.23
[1.033]
( )
( )
20.32
[.800]
4.595
[.181]
PC17
4.595
[.181]
PC1
S7
25.38±0.1
[.999±0.004]
( )
( )
( )
20.32
[.800]
7.62
[.300]
33.66±0.08
[1.325±0.003]
C
1.27
[.050](22X)PITCH
0.40±0.05
[.016±0.002]
C0.6(2X)
(
(
47.80
[1.882]
48.50
[1.910]
)
)
43.03±0.08
[1.694±0.003]
1.300
[.051]
A
A
C OF C
L
40.16±0.1
[1.581±0.004]
45.40±0.1
[1.788±0.004]
( )
( )
25.10±0.1
[.988±0.004]
1.40
[.055]
1.650
[.065]
1.0
[.039]
0.900
[.035]
1.250
[.049]
mm
[inch]
Part No.
N7G24-A0B2XX-00-XHT
N7G24-A0B2XX-10-XHT
Dimension ‘A’
mm [inch]
5.70 [.224]
7.70 [.303]
Tolerance Unless Noted
.0
mm
inch
±.25
±.010
.00
±.15
±.006
.000
±.05
±.002
[ ] Dimensions for Reference
Only
TS-2329-A
Sheet 2 of 4
3
Electronic Solutions Division
Interconnect Solutions
http://www.3Mconnector.com
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
Connector for CFast
™
Card
49.80
[1.961] MIN
7G24 Series
(
40.16
[1.581]
)
24.80
[.976] TYP
41.05
[1.616] MIN
C OF D
L
18.32
[.721] MAX (2X)
51.60
[2.032] MIN
18.15
[.715] MIN (2X)
COMPONENT REFLOW KEEP OUT ZONE
(FOR NO STANDOFF HEIGHT CONNECTOR)
49.80
[1.961] MIN
(
18.32
[.721] MAX (2X)
40.16
[1.581]
)
6.50
[.256] MIN (2X)
6.92
[.272] MIN (2X)
11.50
[.453] MIN (2X)
C OF D
L
32.80
[1.291] MAX
(
24.80
[.976]
TYP
)
14.75
[.581] MIN (2X)
39.23
[1.545] MAX
51.60
[2.032] MIN
COMPONENT REFLOW KEEP OUT ZONE
(FOR 2MM STANDOFF CONNECTOR)
TS-2329-A
Sheet 3 of 4
3
Electronic Solutions Division
Interconnect Solutions
http://www.3Mconnector.com
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
3M
™
Connector for CFast
™
Card
7G24 Series
40.16
[1.581]
6.80
[.268]
3.00
[.118]
8.105
[.319]
20.32
[.800]
4.595
[.181]
7.62
[.300]
1.27
[.050](22X)
0.80±0.05
[.031±0.002]
0.08
L
D
Ø2.30
[Ø.091](2X)
Ø1.75
[Ø.069](2X)
3.00
[.118](2X)
4.00
[.157](2X)
PC17
25.10 24.80
[.988] [.976]
2.50
[.098]
PC1
S7
C OF D
L
S1
Ø1.35
[Ø.053](2X)
45.40
[1.788]
46.60
[1.835]
RECOMMENDED PCB THICKNESS 1.65 [0.066] NOMINAL
HOLE & PAD PATTERN TOL ±0.05 [0.002]
Ordering Information
Physical Configuration (Total Arm Length)
A = 39.23 mm
Card Polarization
B = Normal
**D = Inverse
Mounting Style
2 = Surface Mount, Right Angle
1.27 mm Tail Pitch
N7G24 - A 0 X X XX - X 0 - X XX
Packaging Option
HT = Hard Tray
**WF = Tape & Reel
Preassembly
0 = No preassembly accessory
3 = Right Dual-Push Ejector
(P/N: 7G24-B5A6-05)
5 = Left Dual-Push Ejector
(P/N: 7G24-B6A6-05)
7 = Latching Retainer
(P/N: 7E50-C016-00)
0 = No Standoff
1 = 2 mm Standoff
Plating Suffix
**EA=15 µ" min. Gold plated at mated end and Gold Flash at soldertail. 80 µ" min.
Nickel underplated all over.
**EB=30 µ" min. Gold plated at mated end and Gold Flash a soldertail. 80 µ" min.
Nickel underplated all over.
RA=15 µ" min. Gold plated at mated end and 100 µ" min. Matte-Tin plated at soldertail.
80 µ" min. Nickel underplated all over.
RB=30 µ" min. Gold plated at mated end and 100 µ" min. Matte-Tin plated at soldertail.
80 µ" min. Nickel underplated all over.
Notes:
** are for future development
TS-2329-A
Sheet 4 of 4
3
Electronic Solutions Division
Interconnect Solutions
http://www.3Mconnector.com
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
Important Notice
All statements, technical information, and recommendations related to 3M’s products are based on information believed to be reliable, but the accuracy or completeness
is not guaranteed. Before using this product, you must evaluate it and determine if it is suitable for your intended application. You assume all risks and liability associated
with such use. Any statements related to the product which are not contained in 3M’s current publications, or any contrary statements contained on your purchase order
shall have no force or effect unless expressly agreed upon, in writing, by an authorized officer of 3M.
Warranty; Limited Remedy; Limited Liability.
This product will be free from defects in material and manufacture for a period of one (1) year from the time of purchase.
3M MAKES NO OTHER WARRANTIES
INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
If this product is defective within the
warranty period stated above, your exclusive remedy shall be, at 3M’s option, to replace or repair the 3M product or refund the purchase price of the 3M product.
Except
where prohibited by law, 3M will not be liable for any indirect, special, incidental or consequential loss or damage arising from this 3M product, regardless of
I have a question for you. If I get 10 bits of data through AD, how do I transmit it to the host computer through the serial port RS232? Do I have to transmit it twice, first the first eight bits and ...
[i=s]This post was last edited by dcexpert on 2017-8-2 22:13[/i] The MAX32630 development board comes with a DAPLink emulator (MAXREFDES100HDK). DAPLink is an upgrade of CMSIS-DAP, supporting all the ...
This is the Chinese reference manual of Freescale HCS08 series MCU, including HCS08 MCU CPU architecture, HCS08 working mode instruction set description, BDM debugging interface, etc....
1. Remember, those who watch TV for more than three hours a day on average must be those whose monthly income does not exceed 2,000 yuan. If you want to earn more than 2,000 yuan a month, please do no...
High efficiency and low standby power consumption are two major challenges in today's switching power supply design. Resonant topology or LLC topology is becoming increasingly popular because it ca...[Details]
Traditional broadcasting systems generally need to be operated manually at a fixed time, and can only realize one-way broadcasting with few functions. Traditional bell ringing equipment has a singl...[Details]
introduction
With the continuous optimization of surface mount technology (SMT) and the rapid development of chip component manufacturing technology, the application of chip mounters in the el...[Details]
1. Circuit composition
The whole circuit consists of two parts:
1. Power saving control circuit
As shown in the figure below. Including delay circuit and drive circuit.
(1) Delay ci...[Details]
1. Introduction
Automobile pollution is one of the most important issues that people are most concerned about and need to solve urgently. As an important method for detecting automobile exhau...[Details]
1. Introduction
With the growth of parking demand, the scale of parking lots is becoming larger and larger. A lot of research has been done on intelligent parking lots in China, but most of th...[Details]
Converged processors meet scalability requirements
In current embedded system design, solutions based on MCU, DSP, FPGA and ASIC account for more than 90% of the market share. These solutions ...[Details]
introduction
In the discharge process of tokamak plasma physics, the study of rupture and sawtooth is of great significance. Rupture and sawtooth exist in most tokamaks. Rupture is a notew...[Details]
With the development and widespread application of computer technology, especially in the field of industrial control, computer communication is particularly important. Although serial communication g...[Details]
Aromatic gases are widely present in food, medicine, cosmetics and various daily chemical products, such as snacks, liquor, spices, Chinese herbal medicines, plasters, perfumes, soaps, shampoos, et...[Details]
1 Introduction
Building Automation System (BAS) is a distributed monitoring system (DCS) designed according to distributed information and control theory. It is the result of the mutual de...[Details]
1 Introduction
With the development of control, computer, communication, network technology, etc., a new control technology, namely fieldbus, has emerged in the field of industrial control...[Details]
With the rapid development of intelligent control technology, computers and information technology, the trend of information appliances IA (Information Application), computers and communications integ...[Details]
1 Introduction
There have been many studies on the detection and protection of power grid short circuit and line fault. The short circuit, overload and overvoltage protectors on the market have ...[Details]
Single-chip microcomputers are widely used because of their small size, powerful functions and low price. This article introduces the method of designing a micro electronic piano using the AT89C51 sin...[Details]
51mcu
京公网安备 11010802033920号
EEWORLD
