RISC Microprocessor, 16-Bit, 16MHz, CMOS, CQCC68,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Intel |
| Parts packaging code | QFN |
| package instruction | QCCN, LCC68A,.95SQ |
| Contacts | 68 |
| Reach Compliance Code | compliant |
| bit size | 16 |
| JESD-30 code | S-XQCC-N68 |
| JESD-609 code | e0 |
| Number of terminals | 68 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC68A,.95SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| speed | 16 MHz |
| Maximum slew rate | 180 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
| TR80C188-16 | QA80C188-12 | TA80C188-16 | QA80C188-16 | QR80C188-12 | QR80C188-16 | QN80C188-16 | S80C188-12 | QN80C188-12 | S80C188 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | RISC Microprocessor, 16-Bit, 16MHz, CMOS, CQCC68, | RISC Microprocessor, 16-Bit, 12.5MHz, CMOS, CPGA68, | RISC Microprocessor, 16-Bit, 16MHz, CMOS, CPGA68 | RISC Microprocessor, 16-Bit, 16MHz, CMOS, CPGA68, | RISC Microprocessor, 16-Bit, 12.5MHz, CMOS, CQCC68, | RISC Microprocessor, 16-Bit, 16MHz, CMOS, CQCC68, | RISC Microprocessor, 16-Bit, 16MHz, CMOS, PQCC68 | RISC Microprocessor, 16-Bit, 12MHz, CMOS, PQFP80, | RISC Microprocessor, 16-Bit, 12.5MHz, CMOS, PQCC68 | RISC Microprocessor, 16-Bit, 10MHz, CMOS, PQFP80, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| package instruction | QCCN, LCC68A,.95SQ | PGA, PGA68,11X11 | PGA, PGA68,11X11 | PGA, PGA68,11X11 | QCCN, LCC68A,.95SQ | QCCN, LCC68A,.95SQ | QCCJ, LDCC68,1.0SQ | QFP, QFP80,.7X.9,32 | QCCJ, LDCC68,1.0SQ | QFP, QFP80,.7X.9,32 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | unknown | compliant | unknown | compli |
| bit size | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 code | S-XQCC-N68 | S-XPGA-P68 | S-XPGA-P68 | S-XPGA-P68 | S-XQCC-N68 | S-XQCC-N68 | S-PQCC-J68 | R-PQFP-G80 | S-PQCC-J68 | R-PQFP-G80 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 80 | 68 | 80 |
| Maximum operating temperature | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | QCCN | PGA | PGA | PGA | QCCN | QCCN | QCCJ | QFP | QCCJ | QFP |
| Encapsulate equivalent code | LCC68A,.95SQ | PGA68,11X11 | PGA68,11X11 | PGA68,11X11 | LCC68A,.95SQ | LCC68A,.95SQ | LDCC68,1.0SQ | QFP80,.7X.9,32 | LDCC68,1.0SQ | QFP80,.7X.9,32 |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | CHIP CARRIER | GRID ARRAY | GRID ARRAY | GRID ARRAY | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | FLATPACK | CHIP CARRIER | FLATPACK |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| speed | 16 MHz | 12.5 MHz | 16 MHz | 16 MHz | 12.5 MHz | 16 MHz | 16 MHz | 12 MHz | 12.5 MHz | 10 MHz |
| Maximum slew rate | 180 mA | 150 mA | 180 mA | 180 mA | 150 mA | 180 mA | 180 mA | 120 mA | 150 mA | 100 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | NO | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | PIN/PEG | PIN/PEG | PIN/PEG | NO LEAD | NO LEAD | J BEND | GULL WING | J BEND | GULL WING |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm | 1.27 mm | 0.8 mm |
| Terminal location | QUAD | PERPENDICULAR | PERPENDICULAR | PERPENDICULAR | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
| Parts packaging code | QFN | PGA | - | PGA | QFN | QFN | - | QFP | - | QFP |
| Contacts | 68 | 68 | - | 68 | 68 | 68 | - | 80 | - | 80 |