ADC, Flash Method, 11-Bit, 1 Func, Parallel, Word Access, CMOS, PDIP40,
| Parameter Name | Attribute value |
| Maker | Micro Power Systems |
| Reach Compliance Code | unknown |
| Maximum analog input voltage | 5 V |
| Minimum analog input voltage | |
| Maximum conversion time | 1000 µs |
| Converter type | ADC, FLASH METHOD |
| JESD-30 code | R-PDIP-T40 |
| Maximum linear error (EL) | 0.001% |
| Number of digits | 11 |
| Number of functions | 1 |
| Number of terminals | 40 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Output bit code | OFFSET BINARY |
| Output format | PARALLEL, WORD |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Sampling rate | 1 MHz |
| Maximum slew rate | 20 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| MP7685JN | MP7685TD/883 | MP7685JD | MP7685TD | MP7685SD/883 | MP7685KD | |
|---|---|---|---|---|---|---|
| Description | ADC, Flash Method, 11-Bit, 1 Func, Parallel, Word Access, CMOS, PDIP40, | ADC, Flash Method, 11-Bit, 1 Func, Parallel, Word Access, CMOS, CDIP40, | ADC, Flash Method, 11-Bit, 1 Func, Parallel, Word Access, CMOS, CDIP40, | ADC, Flash Method, 11-Bit, 1 Func, Parallel, Word Access, CMOS, CDIP40, | ADC, Flash Method, 11-Bit, 1 Func, Parallel, Word Access, CMOS, CDIP40, | ADC, Flash Method, 11-Bit, 1 Func, Parallel, Word Access, CMOS, CDIP40, |
| Maker | Micro Power Systems | Micro Power Systems | Micro Power Systems | Micro Power Systems | Micro Power Systems | Micro Power Systems |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| Maximum analog input voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum conversion time | 1000 µs | 1000 µs | 1000 µs | 1000 µs | 1000 µs | 1000 µs |
| Converter type | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 code | R-PDIP-T40 | R-GDIP-T40 | R-GDIP-T40 | R-GDIP-T40 | R-GDIP-T40 | R-GDIP-T40 |
| Maximum linear error (EL) | 0.001% | 0.0011% | 0.001% | 0.0011% | 0.001% | 0.0011% |
| Number of digits | 11 | 11 | 11 | 11 | 11 | 11 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 40 | 40 | 40 | 40 | 40 | 40 |
| Maximum operating temperature | 85 °C | 125 °C | 85 °C | 125 °C | 125 °C | 85 °C |
| Minimum operating temperature | -40 °C | -55 °C | -40 °C | -55 °C | -55 °C | -40 °C |
| Output bit code | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY |
| Output format | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| Package body material | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Sampling rate | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
| Maximum slew rate | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | MILITARY | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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