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320032-001: DescriptionMobile Intel Atom Processor N270 Single Core; File Size501KB，57 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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Mobile Intel Atom Processor N270 Single Core

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Mobile Intel

Atom™ Processor

N270 Single Core

Datasheet

May 2008

Document Number: 320032-001

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR

IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT

AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY

WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL

PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY,

OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY

APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR

DEATH MAY OCCUR.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the

absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future

definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The

information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to

deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order

Enhanced Intel SpeedStep® Technology for specified units of this processor available Q2/06. See the Processor Spec Finder at

http://processorfinder.intel.com

or contact your Intel representative for more information.

Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting

operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.

Intel, Atom, Intel SpeedStep, and the Intel logo are trademarks of Intel Corporation in the U. S. and other countries.

*Other names and brands may be claimed as the property of others.

Datasheet

Contents

Introduction .....................................................................................................6

1.1

1.2

1.3

Major Features.......................................................................................6

Terminology ..........................................................................................7

References ............................................................................................9

Low Power Features ........................................................................................10

2.1

Clock Control and Low-power States .......................................................10

2.1.1

Thread Low-power State Descriptions.........................................12

2.1.2

Package Low-power State Descriptions .......................................13

Dynamic Cache Sizing...........................................................................16

Enhanced Intel SpeedStep

Technology...................................................17

Enhanced Low-Power States ..................................................................18

FSB Low Power Enhancements ...............................................................19

2.5.1

Front Side Bus ........................................................................19

Power and Ground Pins .........................................................................20

FSB Clock (BCLK [1:0]) and Processor Clocking ........................................20

Voltage Identification ............................................................................20

Catastrophic Thermal Protection .............................................................23

Reserved and Unused Pins .....................................................................23

FSB Frequency Select Signals (BSEL [2:0]) ..............................................23

FSB Signal Groups................................................................................24

CMOS Asynchronous Signals ..................................................................25

Maximum Ratings.................................................................................25

Processor DC Specifications ...................................................................26

2.2

2.3

2.4

2.5

Electrical Specifications....................................................................................20

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

3.10

Package Mechanical Specifications and Pin Information.........................................33

4.1

4.2

4.3

Package Mechanical Specifications ..........................................................33

4.1.1

Package Mechanical Drawings ...................................................34

Processor Pin-out Assignment ................................................................34

Signal Description ................................................................................41

Thermal Specifications and Design Considerations ...............................................50

5.1

5.2

5.3

Thermal Diode .....................................................................................51

Intel® Thermal Monitor.........................................................................53

Digital Thermal Sensor..........................................................................55

5.3.1

Out of Specification Detection ...................................................56

5.3.2

PROCHOT# Signal Pin ..............................................................56

Datasheet

Figures

Figure

Thread Low-power States ...................................................................11

Package Low-power States..................................................................11

Active VCC and ICC Processor Loadline .................................................28

Deeper Sleep VCC and ICC Processor Loadline .......................................29

Tables

Table

1. References...........................................................................................9

2. Coordination of Thread Low-power States at the Package Level ................. 12

3. Voltage Identification Definition ............................................................20

4. BSEL [2:0] Encoding for BCLK Frequency ...............................................23

5. FSB Pin Groups...................................................................................24

6. Processor Absolute Maximum Ratings ....................................................26

7. Voltage and Current Specifications for the Processors...............................27

8. FSB Differential BCLK Specifications ......................................................29

9. AGTL+ Signal Group DC Specifications ...................................................30

10. Legacy CMOS Signal Group DC Specifications ........................................31

11. Open Drain Signal Group DC Specifications ...........................................32

12. Pin-out Arranged by Signal Name ........................................................36

13. Signal Description .............................................................................41

14. Power Specifications for the Processor..................................................50

15. Thermal Diode Interface.....................................................................52

16. Thermal Diode Parameters using Transistor Model .................................52

Datasheet

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