Mobile Intel
®
Atom™ Processor
N270 Single Core
Datasheet
May 2008
Document Number: 320032-001
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Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the
absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future
definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The
information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
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Enhanced Intel SpeedStep® Technology for specified units of this processor available Q2/06. See the Processor Spec Finder at
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or contact your Intel representative for more information.
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Copyright © 2008 Intel Corporation. All rights reserved.
2
Datasheet
Contents
1
Introduction .....................................................................................................6
1.1
1.2
1.3
2
Major Features.......................................................................................6
Terminology ..........................................................................................7
References ............................................................................................9
Low Power Features ........................................................................................10
2.1
Clock Control and Low-power States .......................................................10
2.1.1
Thread Low-power State Descriptions.........................................12
2.1.2
Package Low-power State Descriptions .......................................13
Dynamic Cache Sizing...........................................................................16
Enhanced Intel SpeedStep
®
Technology...................................................17
Enhanced Low-Power States ..................................................................18
FSB Low Power Enhancements ...............................................................19
2.5.1
Front Side Bus ........................................................................19
Power and Ground Pins .........................................................................20
FSB Clock (BCLK [1:0]) and Processor Clocking ........................................20
Voltage Identification ............................................................................20
Catastrophic Thermal Protection .............................................................23
Reserved and Unused Pins .....................................................................23
FSB Frequency Select Signals (BSEL [2:0]) ..............................................23
FSB Signal Groups................................................................................24
CMOS Asynchronous Signals ..................................................................25
Maximum Ratings.................................................................................25
Processor DC Specifications ...................................................................26
2.2
2.3
2.4
2.5
3
Electrical Specifications....................................................................................20
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
4
Package Mechanical Specifications and Pin Information.........................................33
4.1
4.2
4.3
Package Mechanical Specifications ..........................................................33
4.1.1
Package Mechanical Drawings ...................................................34
Processor Pin-out Assignment ................................................................34
Signal Description ................................................................................41
5
Thermal Specifications and Design Considerations ...............................................50
5.1
5.2
5.3
Thermal Diode .....................................................................................51
Intel® Thermal Monitor.........................................................................53
Digital Thermal Sensor..........................................................................55
5.3.1
Out of Specification Detection ...................................................56
5.3.2
PROCHOT# Signal Pin ..............................................................56
Datasheet
3
Figures
Figure
Figure
Figure
Figure
1.
2.
3.
4.
Thread Low-power States ...................................................................11
Package Low-power States..................................................................11
Active VCC and ICC Processor Loadline .................................................28
Deeper Sleep VCC and ICC Processor Loadline .......................................29
Tables
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
Table
1. References...........................................................................................9
2. Coordination of Thread Low-power States at the Package Level ................. 12
3. Voltage Identification Definition ............................................................20
4. BSEL [2:0] Encoding for BCLK Frequency ...............................................23
5. FSB Pin Groups...................................................................................24
6. Processor Absolute Maximum Ratings ....................................................26
7. Voltage and Current Specifications for the Processors...............................27
8. FSB Differential BCLK Specifications ......................................................29
9. AGTL+ Signal Group DC Specifications ...................................................30
10. Legacy CMOS Signal Group DC Specifications ........................................31
11. Open Drain Signal Group DC Specifications ...........................................32
12. Pin-out Arranged by Signal Name ........................................................36
13. Signal Description .............................................................................41
14. Power Specifications for the Processor..................................................50
15. Thermal Diode Interface.....................................................................52
16. Thermal Diode Parameters using Transistor Model .................................52
4
Datasheet
Revision History
Document
Number
320032
Revision
Number
001
Initial release.
Description
Revision Date
May 2008
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Datasheet
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