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FM3100-BS-H

Description
Rectifier Diode, Schottky, 1 Phase, 1 Element, 3A, 100V V(RRM), Silicon, DO-214AA, SMB, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size93KB,7 Pages
ManufacturerFORMOSA
Websitehttp://www.formosams.com/
Environmental Compliance
Download Datasheet Parametric View All

FM3100-BS-H Overview

Rectifier Diode, Schottky, 1 Phase, 1 Element, 3A, 100V V(RRM), Silicon, DO-214AA, SMB, 2 PIN

FM3100-BS-H Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerFORMOSA
package instructionR-PDSO-F2
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresLOW POWER LOSS
applicationEFFICIENCY
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
Maximum forward voltage (VF)0.85 V
JEDEC-95 codeDO-214AA
JESD-30 codeR-PDSO-F2
Maximum non-repetitive peak forward current80 A
Number of components1
Phase1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Maximum output current3 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Maximum repetitive peak reverse voltage100 V
Maximum reverse current500 µA
surface mountYES
technologySCHOTTKY
Terminal formFLAT
Terminal locationDUAL
Chip Schottky Barrier Rectifier
FM320-BS THRU FM3200-BS
List
Formosa MS
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2010/04/12
Revised Date
2011/11/11
Revision
E
Page.
7
Page 1
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