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M29W320ET70N6E

Description
Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48
Categorystorage    storage   
File Size1MB,65 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Environmental Compliance  
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M29W320ET70N6E Overview

Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48

M29W320ET70N6E Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicron Technology
Parts packaging codeTSOP
package instructionTSSOP, TSSOP48,.8,20
Contacts48
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time70 ns
Other featuresTOP BOOT BLOCK
Spare memory width8
startup blockTOP
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PDSO-G48
JESD-609 codee3
length18.4 mm
memory density33554432 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size8,63
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP48,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size8K,64K
Maximum standby current0.0001 A
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width12 mm
M29W320ET
M29W320EB
32 Mbit (4Mbx8 or 2Mbx16, Uniform Parameter Blocks, Boot Block)
3V supply Flash memory
Features
Supply voltage
– V
CC
= 2.7V to 3.6V for Program, Erase and
Read
– V
PP
=12V for Fast Program (optional)
Access times: 70, 90ns
Programming time
– 10μs per byte/word typical
– Double word/ Quadruple byte Program
Memory Blocks
– Memory Array: 63 Main Blocks
– 8 Parameter Blocks (Top or Bottom
Location)
Erase Suspend and Resume modes
– Read and Program another Block during
Erase Suspend
Unlock Bypass Program command
– Faster Production/Batch Programming
V
PP
/WP pin for fast Program and Write Protect
Temporary Block Unprotection mode
Common Flash Interface
– 64 bit Security code
Extended memory Block
– Extra block used as security block or to
store additional information
Low power consumption
– Standby and Automatic Standby
100,000 Program/Erase cycles per block
Electronic signature
– Manufacturer code: 0020h
– Top Device code M29W320ET: 2256h
– Bottom Device code M29W320EB: 2257h
RoHS
®
packages available
FBGA
TSOP48 (N)
12 x 20 mm
BGA
TFBGA48 (ZE)
6 x 8 mm
FBGA64 (ZS)
11 x 13 mm
May 2009
Rev 9
1/65
www.numonyx.com
1

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Description Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-48 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48 Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-48 Flash, 2MX16, 70ns, PBGA64, 11 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-64 Flash, 2MX16, 70ns, PBGA64, 11 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-64
Is it Rohs certified? conform to conform to conform to incompatible conform to conform to conform to
Maker Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology
package instruction TSSOP, TSSOP48,.8,20 TSSOP, TSSOP48,.8,20 TFBGA, BGA48,6X8,32 12 X 20 MM, PLASTIC, TSOP-48 TFBGA, BGA48,6X8,32 LBGA, BGA64,8X8,32 LBGA, BGA64,8X8,40
Reach Compliance Code compliant compliant compliant unknown compliant unknown unknow
Maximum access time 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns
Spare memory width 8 8 8 8 8 8 8
startup block TOP BOTTOM TOP BOTTOM BOTTOM TOP BOTTOM
command user interface YES YES YES YES YES YES YES
Universal Flash Interface YES YES YES YES YES YES YES
Data polling YES YES YES YES YES YES YES
JESD-30 code R-PDSO-G48 R-PDSO-G48 R-PBGA-B48 R-PDSO-G48 R-PBGA-B48 R-PBGA-B64 R-PBGA-B64
length 18.4 mm 18.4 mm 8 mm 18.4 mm 8 mm 13 mm 13 mm
memory density 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bi
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 16 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1 1
Number of departments/size 8,63 8,63 8,63 8,63 8,63 8,63 8,63
Number of terminals 48 48 48 48 48 64 64
word count 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
character code 2000000 2000000 2000000 2000000 2000000 2000000 2000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP TFBGA TSSOP TFBGA LBGA LBGA
Encapsulate equivalent code TSSOP48,.8,20 TSSOP48,.8,20 BGA48,6X8,32 TSSOP48,.8,20 BGA48,6X8,32 BGA64,8X8,32 BGA64,8X8,40
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED 260 260 235 260 NOT SPECIFIED NOT SPECIFIED
power supply 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Programming voltage 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
ready/busy YES YES YES YES YES YES YES
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.4 mm 1.4 mm
Department size 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING BALL GULL WING BALL BALL BALL
Terminal pitch 0.5 mm 0.5 mm 0.8 mm 0.5 mm 0.8 mm 1 mm 1 mm
Terminal location DUAL DUAL BOTTOM DUAL BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED 30 30 30 30 NOT SPECIFIED NOT SPECIFIED
switch bit YES YES YES YES YES YES YES
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 12 mm 12 mm 6 mm 12 mm 6 mm 11 mm 11 mm
Is it lead-free? Lead free Lead free Lead free Contains lead Lead free - -
Parts packaging code TSOP TSOP BGA TSOP BGA - -
Contacts 48 48 48 48 48 - -
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A - -
Other features TOP BOOT BLOCK BOTTOM BOOT BLOCK TOP BOOT BLOCK BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK - -
JESD-609 code e3 e4 e1 e0 e1 - -
Terminal surface Matte Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) TIN LEAD Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) - -

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