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M29W320EB70ZE6E

Description
Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-48
Categorystorage    storage   
File Size1MB,65 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Environmental Compliance  
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M29W320EB70ZE6E Overview

Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-48

M29W320EB70ZE6E Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicron Technology
Parts packaging codeBGA
package instructionTFBGA, BGA48,6X8,32
Contacts48
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time70 ns
Other featuresBOTTOM BOOT BLOCK
Spare memory width8
startup blockBOTTOM
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B48
JESD-609 codee1
length8 mm
memory density33554432 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size8,63
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA48,6X8,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
power supply3/3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size8K,64K
Maximum standby current0.0001 A
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
switch bitYES
typeNOR TYPE
width6 mm
M29W320ET
M29W320EB
32 Mbit (4Mbx8 or 2Mbx16, Uniform Parameter Blocks, Boot Block)
3V supply Flash memory
Features
Supply voltage
– V
CC
= 2.7V to 3.6V for Program, Erase and
Read
– V
PP
=12V for Fast Program (optional)
Access times: 70, 90ns
Programming time
– 10μs per byte/word typical
– Double word/ Quadruple byte Program
Memory Blocks
– Memory Array: 63 Main Blocks
– 8 Parameter Blocks (Top or Bottom
Location)
Erase Suspend and Resume modes
– Read and Program another Block during
Erase Suspend
Unlock Bypass Program command
– Faster Production/Batch Programming
V
PP
/WP pin for fast Program and Write Protect
Temporary Block Unprotection mode
Common Flash Interface
– 64 bit Security code
Extended memory Block
– Extra block used as security block or to
store additional information
Low power consumption
– Standby and Automatic Standby
100,000 Program/Erase cycles per block
Electronic signature
– Manufacturer code: 0020h
– Top Device code M29W320ET: 2256h
– Bottom Device code M29W320EB: 2257h
RoHS
®
packages available
FBGA
TSOP48 (N)
12 x 20 mm
BGA
TFBGA48 (ZE)
6 x 8 mm
FBGA64 (ZS)
11 x 13 mm
May 2009
Rev 9
1/65
www.numonyx.com
1

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Description Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-48 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-48 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48 Flash, 2MX16, 70ns, PBGA64, 11 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-64 Flash, 2MX16, 70ns, PBGA64, 11 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-64
Is it Rohs certified? conform to conform to conform to conform to incompatible conform to conform to
Maker Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology
package instruction TFBGA, BGA48,6X8,32 TSSOP, TSSOP48,.8,20 TFBGA, BGA48,6X8,32 TSSOP, TSSOP48,.8,20 12 X 20 MM, PLASTIC, TSOP-48 LBGA, BGA64,8X8,32 LBGA, BGA64,8X8,40
Reach Compliance Code compliant compliant compliant compliant unknown unknown unknow
Maximum access time 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns
Spare memory width 8 8 8 8 8 8 8
startup block BOTTOM BOTTOM TOP TOP BOTTOM TOP BOTTOM
command user interface YES YES YES YES YES YES YES
Universal Flash Interface YES YES YES YES YES YES YES
Data polling YES YES YES YES YES YES YES
JESD-30 code R-PBGA-B48 R-PDSO-G48 R-PBGA-B48 R-PDSO-G48 R-PDSO-G48 R-PBGA-B64 R-PBGA-B64
length 8 mm 18.4 mm 8 mm 18.4 mm 18.4 mm 13 mm 13 mm
memory density 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bi
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 16 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1 1
Number of departments/size 8,63 8,63 8,63 8,63 8,63 8,63 8,63
Number of terminals 48 48 48 48 48 64 64
word count 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
character code 2000000 2000000 2000000 2000000 2000000 2000000 2000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TSSOP TFBGA TSSOP TSSOP LBGA LBGA
Encapsulate equivalent code BGA48,6X8,32 TSSOP48,.8,20 BGA48,6X8,32 TSSOP48,.8,20 TSSOP48,.8,20 BGA64,8X8,32 BGA64,8X8,40
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 260 260 NOT SPECIFIED 235 NOT SPECIFIED NOT SPECIFIED
power supply 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Programming voltage 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
ready/busy YES YES YES YES YES YES YES
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.4 mm 1.4 mm
Department size 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL GULL WING BALL GULL WING GULL WING BALL BALL
Terminal pitch 0.8 mm 0.5 mm 0.8 mm 0.5 mm 0.5 mm 1 mm 1 mm
Terminal location BOTTOM DUAL BOTTOM DUAL DUAL BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 30 NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED
switch bit YES YES YES YES YES YES YES
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 6 mm 12 mm 6 mm 12 mm 12 mm 11 mm 11 mm
Is it lead-free? Lead free Lead free Lead free Lead free Contains lead - -
Parts packaging code BGA TSOP BGA TSOP TSOP - -
Contacts 48 48 48 48 48 - -
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A - -
Other features BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK BOTTOM BOOT BLOCK - -
JESD-609 code e1 e4 e1 e3 e0 - -
Terminal surface Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Matte Tin (Sn) TIN LEAD - -

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