EEWORLDEEWORLDEEWORLD

Part Number

Search

M29W320EB70N6

Description
Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48
Categorystorage    storage   
File Size1MB,65 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric Compare View All

M29W320EB70N6 Online Shopping

Suppliers Part Number Price MOQ In stock  
M29W320EB70N6 - - View Buy Now

M29W320EB70N6 Overview

Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48

M29W320EB70N6 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicron Technology
Parts packaging codeTSOP
package instruction12 X 20 MM, PLASTIC, TSOP-48
Contacts48
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time70 ns
Other featuresBOTTOM BOOT BLOCK
Spare memory width8
startup blockBOTTOM
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PDSO-G48
JESD-609 codee0
length18.4 mm
memory density33554432 bit
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size8,63
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP48,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)235
power supply3/3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size8K,64K
Maximum standby current0.0001 A
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
switch bitYES
typeNOR TYPE
width12 mm
M29W320ET
M29W320EB
32 Mbit (4Mbx8 or 2Mbx16, Uniform Parameter Blocks, Boot Block)
3V supply Flash memory
Features
Supply voltage
– V
CC
= 2.7V to 3.6V for Program, Erase and
Read
– V
PP
=12V for Fast Program (optional)
Access times: 70, 90ns
Programming time
– 10μs per byte/word typical
– Double word/ Quadruple byte Program
Memory Blocks
– Memory Array: 63 Main Blocks
– 8 Parameter Blocks (Top or Bottom
Location)
Erase Suspend and Resume modes
– Read and Program another Block during
Erase Suspend
Unlock Bypass Program command
– Faster Production/Batch Programming
V
PP
/WP pin for fast Program and Write Protect
Temporary Block Unprotection mode
Common Flash Interface
– 64 bit Security code
Extended memory Block
– Extra block used as security block or to
store additional information
Low power consumption
– Standby and Automatic Standby
100,000 Program/Erase cycles per block
Electronic signature
– Manufacturer code: 0020h
– Top Device code M29W320ET: 2256h
– Bottom Device code M29W320EB: 2257h
RoHS
®
packages available
FBGA
TSOP48 (N)
12 x 20 mm
BGA
TFBGA48 (ZE)
6 x 8 mm
FBGA64 (ZS)
11 x 13 mm
May 2009
Rev 9
1/65
www.numonyx.com
1

M29W320EB70N6 Related Products

M29W320EB70N6 M29W320EB70N6E M29W320ET70ZE6E M29W320ET70N6E M29W320EB70ZE6E M29W320ET70ZS6E M29W320EB70ZS6E
Description Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-48 Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-48 Flash, 2MX16, 70ns, PBGA64, 11 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-64 Flash, 2MX16, 70ns, PBGA64, 11 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-64
Is it Rohs certified? incompatible conform to conform to conform to conform to conform to conform to
Maker Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology Micron Technology
package instruction 12 X 20 MM, PLASTIC, TSOP-48 TSSOP, TSSOP48,.8,20 TFBGA, BGA48,6X8,32 TSSOP, TSSOP48,.8,20 TFBGA, BGA48,6X8,32 LBGA, BGA64,8X8,32 LBGA, BGA64,8X8,40
Reach Compliance Code unknown compliant compliant compliant compliant unknown unknow
Maximum access time 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns
Spare memory width 8 8 8 8 8 8 8
startup block BOTTOM BOTTOM TOP TOP BOTTOM TOP BOTTOM
command user interface YES YES YES YES YES YES YES
Universal Flash Interface YES YES YES YES YES YES YES
Data polling YES YES YES YES YES YES YES
JESD-30 code R-PDSO-G48 R-PDSO-G48 R-PBGA-B48 R-PDSO-G48 R-PBGA-B48 R-PBGA-B64 R-PBGA-B64
length 18.4 mm 18.4 mm 8 mm 18.4 mm 8 mm 13 mm 13 mm
memory density 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bi
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 16 16 16 16 16 16 16
Number of functions 1 1 1 1 1 1 1
Number of departments/size 8,63 8,63 8,63 8,63 8,63 8,63 8,63
Number of terminals 48 48 48 48 48 64 64
word count 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
character code 2000000 2000000 2000000 2000000 2000000 2000000 2000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16 2MX16
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP TFBGA TSSOP TFBGA LBGA LBGA
Encapsulate equivalent code TSSOP48,.8,20 TSSOP48,.8,20 BGA48,6X8,32 TSSOP48,.8,20 BGA48,6X8,32 BGA64,8X8,32 BGA64,8X8,40
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 235 260 260 NOT SPECIFIED 260 NOT SPECIFIED NOT SPECIFIED
power supply 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V 3/3.3 V
Programming voltage 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
ready/busy YES YES YES YES YES YES YES
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.4 mm 1.4 mm
Department size 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K 8K,64K
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Maximum slew rate 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA 0.02 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING BALL GULL WING BALL BALL BALL
Terminal pitch 0.5 mm 0.5 mm 0.8 mm 0.5 mm 0.8 mm 1 mm 1 mm
Terminal location DUAL DUAL BOTTOM DUAL BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 30 30 NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED
switch bit YES YES YES YES YES YES YES
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
width 12 mm 12 mm 6 mm 12 mm 6 mm 11 mm 11 mm
Is it lead-free? Contains lead Lead free Lead free Lead free Lead free - -
Parts packaging code TSOP TSOP BGA TSOP BGA - -
Contacts 48 48 48 48 48 - -
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A - -
Other features BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK TOP BOOT BLOCK TOP BOOT BLOCK BOTTOM BOOT BLOCK - -
JESD-609 code e0 e4 e1 e3 e1 - -
Terminal surface TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Matte Tin (Sn) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) - -

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2172  136  2610  1110  1096  44  3  53  23  7 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号