IC 2K X 8 UVPROM, 450 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM
| Parameter Name | Attribute value |
| package instruction | WDIP, |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| Maximum access time | 450 ns |
| Other features | TTL COMPATIBLE INPUTS/OUTPUTS |
| JESD-30 code | R-GDIP-T24 |
| memory density | 16384 bi |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2KX8 |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 5.969 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| Base Number Matches | 1 |
| 27C16Q450/883 | 27C16Q550/883 | |
|---|---|---|
| Description | IC 2K X 8 UVPROM, 450 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM | IC 2K X 8 UVPROM, 550 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM |
| package instruction | WDIP, | WDIP, |
| Reach Compliance Code | unknow | unknow |
| ECCN code | EAR99 | EAR99 |
| Maximum access time | 450 ns | 550 ns |
| Other features | TTL COMPATIBLE INPUTS/OUTPUTS | TTL COMPATIBLE INPUTS/OUTPUTS |
| JESD-30 code | R-GDIP-T24 | R-GDIP-T24 |
| memory density | 16384 bi | 16384 bi |
| Memory IC Type | UVPROM | UVPROM |
| memory width | 8 | 8 |
| Number of functions | 1 | 1 |
| Number of terminals | 24 | 24 |
| word count | 2048 words | 2048 words |
| character code | 2000 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C |
| organize | 2KX8 | 2KX8 |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP | WDIP |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, WINDOW | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 5.969 mm | 5.969 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | NO |
| technology | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL |
| width | 15.24 mm | 15.24 mm |