MF3ICDH4101DUD/05 datasheet, PDF

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MF3ICDH4101DUD/05: DescriptionIC,SMART CARD INTERFACE/CONTROL,WAFER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size467KB，2 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MF3ICDH4101DUD/05 Overview

IC,SMART CARD INTERFACE/CONTROL,WAFER

MF3ICDH4101DUD/05 Parametric

Parameter Name	Attribute value
Maker	NXP
package instruction	DIE, WAFER
Reach Compliance Code	compliant
JESD-30 code	X-XUUC-N
Maximum operating temperature	70 °C
Minimum operating temperature	-25 °C
Package body material	UNSPECIFIED
encapsulated code	DIE
Encapsulate equivalent code	WAFER
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	NO LEAD
Terminal location	UPPER
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT

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NXP IC solution for contactless

multi-application, high-speed

and secure smart cards

MIFARE DESFire™ EV1

MIFARE DESFire EV1 is ideal for solution developers and providers wanting to combine

and support multiple applications on one contactless smart card. It fully complies with

the requirements for fast and secure data transmission, flexible memory organization, and

interoperability with existing infrastructure.

Key applications

Advanced public transportation

Access management

E-Government incl. social services

Closed loop micro-payment

Loyalty programs

Key features

Fully ISO / IEC 14443 A 1-4 compliant

2/4/8-Kbyte EEPROM with fast programming

Secure, high-speed command set

High data rates according to ISO / IEC 14443-4:

up to 848 Kbit/s

Flexible file structure

Choice of open DES/2K3DES/3K3DES/AES

crypto algorithm in hardware

Anti-collision

Privacy protection

Unique 7-byte serial number (ISO cascade level 2)

Data integrity: CRC and bit counting on physical layer

Available in MOA4 modules or 8” sawn bumped wafer

Common Criteria certification: EAL4+ for IC HW and SW

MIFARE DESFire EV1 is based on open global standards for

both air interfaces and cryptographic methods. It is compliant

to all four levels of ISO / IEC 14443 A and uses optional

ISO / IEC 7816-4 commands.

Featuring an on-chip backup management system and the

mutual three pass authentication, a MIFARE DESFire EV1

card can hold up to 28 different applications and 32 files per

application. The size and access conditions of each file are

defined at the moment of its creation, making

MIFARE DESFire EV1 a truly flexible and convenient product.

Additionally, an automatic anti-tear mechanism is available

for all file types, which guarantees transaction oriented data

integrity. With MIFARE DESFire EV1, data transfer rates up

to 848 Kbit/s can be achieved, making fast data processing

possible. The chip’s main characteristics are denoted by its

name DESFire EV1, the first evolution of MIFARE DESFire:

DES indicates the commitment for high levels of security -

NXP_03_0227_updateMifare_Desfire_Leaflet939775017024_v4.indd

19/11/10

13:51

MF3ICDH4101DUD/05 Related Products

	MF3ICDH4101DUD/05	MF3ICDH2101DUD/05	MF3MOD2101DA4/05	MF3MODH2101DA4/05
Description	IC,SMART CARD INTERFACE/CONTROL,WAFER	IC,SMART CARD INTERFACE/CONTROL,WAFER	Microprocessor Circuit	Microprocessor Circuit
Maker	NXP	NXP	NXP	NXP
package instruction	DIE, WAFER	DIE, WAFER	SOT500-2	,
Reach Compliance Code	compliant	compliant	unknown	unknown
JESD-30 code	X-XUUC-N	X-XUUC-N	X-PXMA-N	X-PXMA-N
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
Minimum operating temperature	-25 °C	-25 °C	-25 °C	-25 °C
Package body material	UNSPECIFIED	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY
Package shape	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package form	UNCASED CHIP	UNCASED CHIP	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	UPPER	UPPER	UNSPECIFIED	UNSPECIFIED
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT

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