MX929ADW datasheet, PDF - EEWORLD Datasheet

MX929ADW: DescriptionModem-Support Circuit, CMOS, PDSO24, SOIC-24; CategoryWireless rf/communication Telecom circuit; File Size3MB，39 Pages; ManufacturerCML Microcircuits; Websitehttp://www.cmlmicro.com/

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MX929ADW Overview

Modem-Support Circuit, CMOS, PDSO24, SOIC-24

Parameter Name	Attribute value
Maker	CML Microcircuits
Parts packaging code	SOIC
package instruction	SOP,
Contacts	24
Reach Compliance Code	unknown
Other features	HALF DUPLEX
JESD-30 code	R-PDSO-G24
length	15.4 mm
Number of functions	1
Number of terminals	24
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Certification status	Not Qualified
Maximum seat height	2.65 mm
surface mount	YES
technology	CMOS
Telecom integrated circuit types	MODEM-SUPPORT CIRCUIT
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	7.5 mm

	MX929ADW	MX929AP	MX929ADS	MX929ALH
Description	Modem-Support Circuit, CMOS, PDSO24, SOIC-24	Modem-Support Circuit, CMOS, PDIP24, PLASTIC, DIP-24	Modem-Support Circuit, CMOS, PDSO24, SSOP-24	Modem-Support Circuit, CMOS, PQCC24, PLASTIC, LCC-24
Maker	CML Microcircuits	CML Microcircuits	CML Microcircuits	CML Microcircuits
Parts packaging code	SOIC	DIP	SSOP	LCC
package instruction	SOP,	DIP,	SSOP,	QCCJ,
Contacts	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown
Other features	HALF DUPLEX	HALF DUPLEX	HALF DUPLEX	HALF DUPLEX
JESD-30 code	R-PDSO-G24	R-PDIP-T24	R-PDSO-G24	S-PQCC-J24
length	15.4 mm	31.37 mm	8.2 mm	10.16 mm
Number of functions	1	1	1	1
Number of terminals	24	24	24	24
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP	SSOP	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	SMALL OUTLINE	IN-LINE	SMALL OUTLINE, SHRINK PITCH	CHIP CARRIER
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.65 mm	5.59 mm	1.99 mm	3.7 mm
surface mount	YES	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Telecom integrated circuit types	MODEM-SUPPORT CIRCUIT	MODEM-SUPPORT CIRCUIT	MODEM-SUPPORT CIRCUIT	MODEM-SUPPORT CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	THROUGH-HOLE	GULL WING	J BEND
Terminal pitch	1.27 mm	2.54 mm	0.65 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	QUAD
width	7.5 mm	15.24 mm	5.29 mm	10.16 mm

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