MX929AP datasheet, PDF - EEWORLD Datasheet

MX929AP: DescriptionModem-Support Circuit, CMOS, PDIP24, PLASTIC, DIP-24; CategoryWireless rf/communication Telecom circuit; File Size3MB，39 Pages; ManufacturerCML Microcircuits; Websitehttp://www.cmlmicro.com/

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MX929AP Overview

Modem-Support Circuit, CMOS, PDIP24, PLASTIC, DIP-24

Parameter Name	Attribute value
Maker	CML Microcircuits
Parts packaging code	DIP
package instruction	DIP,
Contacts	24
Reach Compliance Code	unknown
Other features	HALF DUPLEX
JESD-30 code	R-PDIP-T24
length	31.37 mm
Number of functions	1
Number of terminals	24
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	5.59 mm
surface mount	NO
technology	CMOS
Telecom integrated circuit types	MODEM-SUPPORT CIRCUIT
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

	MX929AP	MX929ADS	MX929ADW	MX929ALH
Description	Modem-Support Circuit, CMOS, PDIP24, PLASTIC, DIP-24	Modem-Support Circuit, CMOS, PDSO24, SSOP-24	Modem-Support Circuit, CMOS, PDSO24, SOIC-24	Modem-Support Circuit, CMOS, PQCC24, PLASTIC, LCC-24
Maker	CML Microcircuits	CML Microcircuits	CML Microcircuits	CML Microcircuits
Parts packaging code	DIP	SSOP	SOIC	LCC
package instruction	DIP,	SSOP,	SOP,	QCCJ,
Contacts	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown
Other features	HALF DUPLEX	HALF DUPLEX	HALF DUPLEX	HALF DUPLEX
JESD-30 code	R-PDIP-T24	R-PDSO-G24	R-PDSO-G24	S-PQCC-J24
length	31.37 mm	8.2 mm	15.4 mm	10.16 mm
Number of functions	1	1	1	1
Number of terminals	24	24	24	24
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SSOP	SOP	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	IN-LINE	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE	CHIP CARRIER
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.59 mm	1.99 mm	2.65 mm	3.7 mm
surface mount	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Telecom integrated circuit types	MODEM-SUPPORT CIRCUIT	MODEM-SUPPORT CIRCUIT	MODEM-SUPPORT CIRCUIT	MODEM-SUPPORT CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	J BEND
Terminal pitch	2.54 mm	0.65 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	QUAD
width	15.24 mm	5.29 mm	7.5 mm	10.16 mm

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