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MX929ALH

Description
Modem-Support Circuit, CMOS, PQCC24, PLASTIC, LCC-24
CategoryWireless rf/communication    Telecom circuit   
File Size3MB,39 Pages
ManufacturerCML Microcircuits
Websitehttp://www.cmlmicro.com/
Download Datasheet Parametric Compare View All

MX929ALH Overview

Modem-Support Circuit, CMOS, PQCC24, PLASTIC, LCC-24

MX929ALH Parametric

Parameter NameAttribute value
MakerCML Microcircuits
Parts packaging codeLCC
package instructionQCCJ,
Contacts24
Reach Compliance Codeunknown
Other featuresHALF DUPLEX
JESD-30 codeS-PQCC-J24
length10.16 mm
Number of functions1
Number of terminals24
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeSQUARE
Package formCHIP CARRIER
Certification statusNot Qualified
Maximum seat height3.7 mm
surface mountYES
technologyCMOS
Telecom integrated circuit typesMODEM-SUPPORT CIRCUIT
Temperature levelINDUSTRIAL
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
width10.16 mm

MX929ALH Related Products

MX929ALH MX929AP MX929ADS MX929ADW
Description Modem-Support Circuit, CMOS, PQCC24, PLASTIC, LCC-24 Modem-Support Circuit, CMOS, PDIP24, PLASTIC, DIP-24 Modem-Support Circuit, CMOS, PDSO24, SSOP-24 Modem-Support Circuit, CMOS, PDSO24, SOIC-24
Maker CML Microcircuits CML Microcircuits CML Microcircuits CML Microcircuits
Parts packaging code LCC DIP SSOP SOIC
package instruction QCCJ, DIP, SSOP, SOP,
Contacts 24 24 24 24
Reach Compliance Code unknown unknown unknown unknown
Other features HALF DUPLEX HALF DUPLEX HALF DUPLEX HALF DUPLEX
JESD-30 code S-PQCC-J24 R-PDIP-T24 R-PDSO-G24 R-PDSO-G24
length 10.16 mm 31.37 mm 8.2 mm 15.4 mm
Number of functions 1 1 1 1
Number of terminals 24 24 24 24
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ DIP SSOP SOP
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.7 mm 5.59 mm 1.99 mm 2.65 mm
surface mount YES NO YES YES
technology CMOS CMOS CMOS CMOS
Telecom integrated circuit types MODEM-SUPPORT CIRCUIT MODEM-SUPPORT CIRCUIT MODEM-SUPPORT CIRCUIT MODEM-SUPPORT CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form J BEND THROUGH-HOLE GULL WING GULL WING
Terminal pitch 1.27 mm 2.54 mm 0.65 mm 1.27 mm
Terminal location QUAD DUAL DUAL DUAL
width 10.16 mm 15.24 mm 5.29 mm 7.5 mm
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