SMD
FYLS 0805BUBC
FYLS-0805BUBC
Features:
Compatible with automatic placement equipment
Compatible with reflow solder process.
Radiation pattern.
Applications:
Automotive-Telecommumication
Indicators
Lcd Back-lights
Illuminations
Relative Lumionous Intensity(LOP @max=1)
Descriptions:
Dice material: InGaN.
Emitting Color: Blue.
Lens Color: Water clear.
ratings(Ta=25゜
Absolute maximun ratings(Ta=25
゜
с)
Parameter
Power Dissipation
Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse
Width)
Continuous Forward Current
Derating Linear From 25℃
Operating Temperature Range
Storage Temperature Range
Lead Soldering Temperature[4mm(.157”) From Body]
MAX.
70
100
15
0.4
-30
℃
to +80
℃
-40
℃
to +100℃
260
℃
for 5 Seconds
Unit
mW
mA
mA
mA/℃
characteristics(Ta=25゜
Electrical and optical characteristics(Ta=25
゜
с)
Parameter
Luminous Intensity
Viewing Angle
Peak Emission
Wavelength
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
Reverse Current
Symbol
IV
2θ1/2
λp
λd
△
λ
VF
IR
Min.
--
120
463
460
10
Typ.
120
130
468
465
15
3.2
Max.
--
140
473
470
20
3.6
10
Unit
mcd
Deg
nm
nm
nm
V
A
Test Condition
IF=20mA
VR=5V
SMD
Typical Electrical Characteristics Curves
(25゜
(25
゜
с Ambient Temperature Unless Otherwise Noted)
Spectral Reduance
Normalized Response
Wave Length(nm)
L u m i n o u s I n t e n s i t y V s . f o r w a r d C u r r e n t
L u m i n o u s I n t e n s i t y V s . f o r w a r d C u r r e n t
1000
R e l a t i v e l u m i n o u s i n t e n s i t y ( % )
50
40
R e l a t i v e l u m i n o u s i n t e n s i t y ( % )
100
30
20
10
10
0
2.4
0
1
10
100
1000
F o r w a r d V o l t a g e ( V F ) - v o l t s
2.8
3.2
3.6
4.0
4.4
Forward Current(mA)
L u m i n o u s I n t e n s i t y V s .
A m b i e n t T e m p e r a t u r e
Forward Current Derating Curve
6 0
5 0
Forward Current(mA)
4 0
3 0
2 0
1 0
0
0
1 0
2 0
3 0
4 0
5 0
6 0
7 0
8 0
9 0
Relative Luminous Intensity
1000
100
0
-60
-35
-10
15
40
65
90
Ambient Temperature TA(
C
)
Ambient Temperature TA( C)
SMD
Precautions For Use
Over-current-proof
Customer must apply resistors for protection,otherwise slight voltage shift will cause big
current chang(Burn out will happen)
Storage
1.
The operation of temperature and R.H are:5゜с ---30゜с,R.H.60% Max.
2.
Once the package is opened ,the products should be used within a week. Otherwise,they
Should be kept in a dampproof box with desccating regent.Considering the tape life,we
Suggest our customers to use our products within 1.5year (form production date).
3.
It’s recommended to bake before soldering when the package is unsealed after 72hrs.The
Condition is: 60゜с ±5゜с for 15 hrs.
Soldering Iron:
Temperature at tip of iron:300゜с Max.(25W Max)
Soldering time:3±1sec.
Reflow Temp./Time:
Temperature
Time
SMD
Package Dimensions of Device
S o l d e r i n g
T e r m i n a l
1.25
Cathode Mark
0.3
0.4
lED Die
1.4
2.0
PCB
1.25
1.2
1.2
Resin
0.9
1.2
0.5
0.625
1.1
0.4
1.2
Unit:mm
Tape Specification:3000pcs Per Reel.
Packing Size
Item
Spec.
Tolerance
Item
Spec.
Tolerance
W
P1
E
F
D0
D1
P0
Unit
mm
mm
8.00
±0.20
10P0
40.00
±0.20
Cathode
4.00
±0.10
P2
2.00
±0.05
D0
P2
1.75
±0.10
A0
1.40
±0.10
3.50
±0.05
B0
2.25
±0.10
P0
1.50
+0.1/-0
K0
1.35
±0.10
1.0
±0.05
T
0.23
±0.05
E
A'
4.00
±0.05
Unit
mm
mm
K0
F
W
D1
P1
A0
A'
t
SEC:A-A'
Dimensions
Package Dimensions of Reel:
60+0.5/-0
13.5±0.2
178±1.0
12±0.15
9±0.1
B0
Unit:mm
SMD
Packing and Shipping Spec.
L1
sb
sb
Zip-lock
Desiccant
Antistatic
Bag
W1
Desiccant
Spec.
Spec.
203.0.
Spec.
198.0
Unit:mm
Box Dimension(cm):30 * 19* 11.5
)
c s
( p
T Y
Q '
.
N O
R T
P A
10 Reels per box
CARTON
Dimension(cm):39*32*38
6boxs/carton
0603B/0603/0805:
4000pcs*10Reels*6boxs
0805B/1206B/
1206 1210
/1204:
3000pcs*10Reels*6boxs*
3528:2000pcs*10Reels*6boxs
5050:1000pcs*8Reels*6boxs
S
K G
S
K G
W
G .
CM
38
W
1*
N .
*3
38
S:
A
C/NO
M E
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