BAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS
| Parameter Name | Attribute value |
| Maker | CML Microcircuits |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.6 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| Other features | FULL DUPLEX |
| data rate | 1.2 Mbps |
| JESD-30 code | R-GDIP-T24 |
| length | 31.75 mm |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -30 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.49 mm |
| Maximum slew rate | 0.007 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Telecom integrated circuit types | MODEM |
| Temperature level | OTHER |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| Base Number Matches | 1 |
| FX429J | FX429 | FX429LG | FX429LS | |
|---|---|---|---|---|
| Description | BAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS | BAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS | BAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS | BAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS |
| Maker | CML Microcircuits | - | CML Microcircuits | CML Microcircuits |
| Parts packaging code | DIP | - | QFP | LCC |
| package instruction | DIP, DIP24,.6 | - | QFP, QFP24,.6SQ,50 | QCCJ, LDCC24,.44SQ |
| Contacts | 24 | - | 24 | 24 |
| Reach Compliance Code | unknown | - | unknown | unknown |
| Other features | FULL DUPLEX | - | FULL DUPLEX | FULL DUPLEX |
| data rate | 1.2 Mbps | - | 1.2 Mbps | 1.2 Mbps |
| JESD-30 code | R-GDIP-T24 | - | S-PQFP-G24 | S-PQCC-J24 |
| length | 31.75 mm | - | 10.125 mm | 10.16 mm |
| Number of functions | 1 | - | 1 | 1 |
| Number of terminals | 24 | - | 24 | 24 |
| Maximum operating temperature | 85 °C | - | 70 °C | 70 °C |
| Minimum operating temperature | -30 °C | - | -30 °C | -30 °C |
| Package body material | CERAMIC, GLASS-SEALED | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | - | QFP | QCCJ |
| Encapsulate equivalent code | DIP24,.6 | - | QFP24,.6SQ,50 | LDCC24,.44SQ |
| Package shape | RECTANGULAR | - | SQUARE | SQUARE |
| Package form | IN-LINE | - | FLATPACK | CHIP CARRIER |
| power supply | 5 V | - | 5 V | 5 V |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified |
| Maximum seat height | 5.49 mm | - | 2.5 mm | 3.7 mm |
| Maximum slew rate | 0.007 mA | - | 0.007 mA | 0.007 mA |
| Nominal supply voltage | 5 V | - | 5 V | 5 V |
| surface mount | NO | - | YES | YES |
| technology | CMOS | - | CMOS | CMOS |
| Telecom integrated circuit types | MODEM | - | MODEM | MODEM |
| Temperature level | OTHER | - | OTHER | OTHER |
| Terminal form | THROUGH-HOLE | - | GULL WING | J BEND |
| Terminal pitch | 2.54 mm | - | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | - | QUAD | QUAD |
| width | 15.24 mm | - | 10.125 mm | 10.16 mm |
| Base Number Matches | 1 | - | 1 | 1 |
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