FX429LS datasheet, PDF - EEWORLD Datasheet

FX429LS: DescriptionBAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS; CategoryWireless rf/communication Telecom circuit; File Size483KB，14 Pages; ManufacturerCML Microcircuits; Websitehttp://www.cmlmicro.com/

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FX429LS Overview

BAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS

Parameter Name	Attribute value
Maker	CML Microcircuits
Parts packaging code	LCC
package instruction	QCCJ, LDCC24,.44SQ
Contacts	24
Reach Compliance Code	unknown
Other features	FULL DUPLEX
data rate	1.2 Mbps
JESD-30 code	S-PQCC-J24
length	10.16 mm
Number of functions	1
Number of terminals	24
Maximum operating temperature	70 °C
Minimum operating temperature	-30 °C
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC24,.44SQ
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	5 V
Certification status	Not Qualified
Maximum seat height	3.7 mm
Maximum slew rate	0.007 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Telecom integrated circuit types	MODEM
Temperature level	OTHER
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
width	10.16 mm
Base Number Matches	1

	FX429LS	FX429	FX429J	FX429LG
Description	BAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS	BAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS	BAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS	BAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS
Maker	CML Microcircuits	-	CML Microcircuits	CML Microcircuits
Parts packaging code	LCC	-	DIP	QFP
package instruction	QCCJ, LDCC24,.44SQ	-	DIP, DIP24,.6	QFP, QFP24,.6SQ,50
Contacts	24	-	24	24
Reach Compliance Code	unknown	-	unknown	unknown
Other features	FULL DUPLEX	-	FULL DUPLEX	FULL DUPLEX
data rate	1.2 Mbps	-	1.2 Mbps	1.2 Mbps
JESD-30 code	S-PQCC-J24	-	R-GDIP-T24	S-PQFP-G24
length	10.16 mm	-	31.75 mm	10.125 mm
Number of functions	1	-	1	1
Number of terminals	24	-	24	24
Maximum operating temperature	70 °C	-	85 °C	70 °C
Minimum operating temperature	-30 °C	-	-30 °C	-30 °C
Package body material	PLASTIC/EPOXY	-	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	QCCJ	-	DIP	QFP
Encapsulate equivalent code	LDCC24,.44SQ	-	DIP24,.6	QFP24,.6SQ,50
Package shape	SQUARE	-	RECTANGULAR	SQUARE
Package form	CHIP CARRIER	-	IN-LINE	FLATPACK
power supply	5 V	-	5 V	5 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	3.7 mm	-	5.49 mm	2.5 mm
Maximum slew rate	0.007 mA	-	0.007 mA	0.007 mA
Nominal supply voltage	5 V	-	5 V	5 V
surface mount	YES	-	NO	YES
technology	CMOS	-	CMOS	CMOS
Telecom integrated circuit types	MODEM	-	MODEM	MODEM
Temperature level	OTHER	-	OTHER	OTHER
Terminal form	J BEND	-	THROUGH-HOLE	GULL WING
Terminal pitch	1.27 mm	-	2.54 mm	1.27 mm
Terminal location	QUAD	-	DUAL	QUAD
width	10.16 mm	-	15.24 mm	10.125 mm
Base Number Matches	1	-	1	1

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