BAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS
| Parameter Name | Attribute value |
| Maker | CML Microcircuits |
| Parts packaging code | QFP |
| package instruction | QFP, QFP24,.6SQ,50 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| Other features | FULL DUPLEX |
| data rate | 1.2 Mbps |
| JESD-30 code | S-PQFP-G24 |
| length | 10.125 mm |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -30 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Encapsulate equivalent code | QFP24,.6SQ,50 |
| Package shape | SQUARE |
| Package form | FLATPACK |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.5 mm |
| Maximum slew rate | 0.007 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Telecom integrated circuit types | MODEM |
| Temperature level | OTHER |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| width | 10.125 mm |
| Base Number Matches | 1 |
| FX429LG | FX429 | FX429J | FX429LS | |
|---|---|---|---|---|
| Description | BAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS | BAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS | BAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS | BAND FFSK MODEM FOR TRUNKED RADIO SYSTEMS |
| Maker | CML Microcircuits | - | CML Microcircuits | CML Microcircuits |
| Parts packaging code | QFP | - | DIP | LCC |
| package instruction | QFP, QFP24,.6SQ,50 | - | DIP, DIP24,.6 | QCCJ, LDCC24,.44SQ |
| Contacts | 24 | - | 24 | 24 |
| Reach Compliance Code | unknown | - | unknown | unknown |
| Other features | FULL DUPLEX | - | FULL DUPLEX | FULL DUPLEX |
| data rate | 1.2 Mbps | - | 1.2 Mbps | 1.2 Mbps |
| JESD-30 code | S-PQFP-G24 | - | R-GDIP-T24 | S-PQCC-J24 |
| length | 10.125 mm | - | 31.75 mm | 10.16 mm |
| Number of functions | 1 | - | 1 | 1 |
| Number of terminals | 24 | - | 24 | 24 |
| Maximum operating temperature | 70 °C | - | 85 °C | 70 °C |
| Minimum operating temperature | -30 °C | - | -30 °C | -30 °C |
| Package body material | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| encapsulated code | QFP | - | DIP | QCCJ |
| Encapsulate equivalent code | QFP24,.6SQ,50 | - | DIP24,.6 | LDCC24,.44SQ |
| Package shape | SQUARE | - | RECTANGULAR | SQUARE |
| Package form | FLATPACK | - | IN-LINE | CHIP CARRIER |
| power supply | 5 V | - | 5 V | 5 V |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified |
| Maximum seat height | 2.5 mm | - | 5.49 mm | 3.7 mm |
| Maximum slew rate | 0.007 mA | - | 0.007 mA | 0.007 mA |
| Nominal supply voltage | 5 V | - | 5 V | 5 V |
| surface mount | YES | - | NO | YES |
| technology | CMOS | - | CMOS | CMOS |
| Telecom integrated circuit types | MODEM | - | MODEM | MODEM |
| Temperature level | OTHER | - | OTHER | OTHER |
| Terminal form | GULL WING | - | THROUGH-HOLE | J BEND |
| Terminal pitch | 1.27 mm | - | 2.54 mm | 1.27 mm |
| Terminal location | QUAD | - | DUAL | QUAD |
| width | 10.125 mm | - | 15.24 mm | 10.16 mm |
| Base Number Matches | 1 | - | 1 | 1 |
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