AM27LS02/BEA datasheet, PDF - EEWORLD Datasheet

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AM27LS02/BEA: DescriptionStandard SRAM, 16X4, 65ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16; Categorystorage storage; File Size224KB，8 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM27LS02/BEA Overview

Standard SRAM, 16X4, 65ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16

AM27LS02/BEA Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	DIP
package instruction	DIP, DIP16,.3
Contacts	16
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	65 ns
JESD-30 code	R-GDIP-T16
JESD-609 code	e0
length	19.431 mm
memory density	64 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	16
word count	16 words
character code	16
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	16X4
Output characteristics	OPEN-COLLECTOR
Exportable	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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AM27LS02/BEA Related Products

	AM27LS02/BEA	AM27LS02DCB	AM27LS02DC	AM27LS02PC	AM27LS02PCB	AM27LS02/BFA	AM27LS02/B2C
Description	Standard SRAM, 16X4, 65ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16	Standard SRAM, 16X4, 55ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16	Standard SRAM, 16X4, 55ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16	Standard SRAM, 16X4, 55ns, TTL, PDIP16, PLASTIC, DIP-16	Standard SRAM, 16X4, 55ns, TTL, PDIP16, PLASTIC, DIP-16	Standard SRAM, 16X4, 65ns, TTL, CDFP16, CERAMIC, FP-16	Standard SRAM, 16X4, 65ns, TTL, CQCC20, CERAMIC, LCC-20
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DFP	QLCC
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL16,.3	QCCN, LCC20,.35SQ
Contacts	16	16	16	16	16	16	20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	EAR99	EAR99	EAR99	EAR99	3A001.A.2.C	3A001.A.2.C
Maximum access time	65 ns	55 ns	55 ns	55 ns	55 ns	65 ns	65 ns
JESD-30 code	R-GDIP-T16	R-GDIP-T16	R-GDIP-T16	R-PDIP-T16	R-PDIP-T16	R-GDFP-F16	S-CQCC-N20
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	19.431 mm	19.431 mm	19.431 mm	19.05 mm	19.05 mm	10.16 mm	8.89 mm
memory density	64 bit	64 bit	64 bit	64 bit	64 bit	64 bit	64 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1
Number of terminals	16	16	16	16	16	16	20
word count	16 words	16 words	16 words	16 words	16 words	16 words	16 words
character code	16	16	16	16	16	16	16
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	75 °C	75 °C	75 °C	75 °C	125 °C	125 °C
organize	16X4	16X4	16X4	16X4	16X4	16X4	16X4
Output characteristics	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR
Exportable	NO	NO	NO	NO	NO	NO	NO
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP	DIP	DFP	QCCN
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	FL16,.3	LCC20,.35SQ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	FLATPACK	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	2.159 mm	2.54 mm
Maximum supply voltage (Vsup)	5.5 V	5.25 V	5.25 V	5.25 V	5.25 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.75 V	4.75 V	4.75 V	4.75 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	YES	YES
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT	NO LEAD
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	6.731 mm	8.89 mm
Maker	AMD	-	-	AMD	AMD	AMD	AMD

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