Standard SRAM, 16X4, 55ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DIP |
| package instruction | DIP, DIP16,.3 |
| Contacts | 16 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 55 ns |
| JESD-30 code | R-GDIP-T16 |
| JESD-609 code | e0 |
| length | 19.431 mm |
| memory density | 64 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 16 |
| word count | 16 words |
| character code | 16 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 75 °C |
| Minimum operating temperature | |
| organize | 16X4 |
| Output characteristics | OPEN-COLLECTOR |
| Exportable | NO |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| AM27LS02DCB | AM27LS02DC | AM27LS02PC | AM27LS02PCB | AM27LS02/BEA | AM27LS02/BFA | AM27LS02/B2C | |
|---|---|---|---|---|---|---|---|
| Description | Standard SRAM, 16X4, 55ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | Standard SRAM, 16X4, 55ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | Standard SRAM, 16X4, 55ns, TTL, PDIP16, PLASTIC, DIP-16 | Standard SRAM, 16X4, 55ns, TTL, PDIP16, PLASTIC, DIP-16 | Standard SRAM, 16X4, 65ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | Standard SRAM, 16X4, 65ns, TTL, CDFP16, CERAMIC, FP-16 | Standard SRAM, 16X4, 65ns, TTL, CQCC20, CERAMIC, LCC-20 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DFP | QLCC |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | QCCN, LCC20,.35SQ |
| Contacts | 16 | 16 | 16 | 16 | 16 | 16 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Maximum access time | 55 ns | 55 ns | 55 ns | 55 ns | 65 ns | 65 ns | 65 ns |
| JESD-30 code | R-GDIP-T16 | R-GDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-GDIP-T16 | R-GDFP-F16 | S-CQCC-N20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 19.431 mm | 19.431 mm | 19.05 mm | 19.05 mm | 19.431 mm | 10.16 mm | 8.89 mm |
| memory density | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 20 |
| word count | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words | 16 words |
| character code | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 75 °C | 75 °C | 75 °C | 75 °C | 125 °C | 125 °C | 125 °C |
| organize | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 | 16X4 |
| Output characteristics | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
| Exportable | NO | NO | NO | NO | NO | NO | NO |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DFP | QCCN |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 | LCC20,.35SQ |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 2.159 mm | 2.54 mm |
| Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | YES | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 6.731 mm | 8.89 mm |
| Maker | - | - | AMD | AMD | AMD | AMD | AMD |
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