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AM27LS02/B2C

Description
Standard SRAM, 16X4, 65ns, TTL, CQCC20, CERAMIC, LCC-20
Categorystorage    storage   
File Size224KB,8 Pages
ManufacturerAMD
Websitehttp://www.amd.com
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AM27LS02/B2C Overview

Standard SRAM, 16X4, 65ns, TTL, CQCC20, CERAMIC, LCC-20

AM27LS02/B2C Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeQLCC
package instructionQCCN, LCC20,.35SQ
Contacts20
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time65 ns
JESD-30 codeS-CQCC-N20
JESD-609 codee0
length8.89 mm
memory density64 bit
Memory IC TypeSTANDARD SRAM
memory width4
Number of functions1
Number of ports1
Number of terminals20
word count16 words
character code16
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize16X4
Output characteristicsOPEN-COLLECTOR
ExportableNO
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQCCN
Encapsulate equivalent codeLCC20,.35SQ
Package shapeSQUARE
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height2.54 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width8.89 mm

AM27LS02/B2C Related Products

AM27LS02/B2C AM27LS02DCB AM27LS02DC AM27LS02PC AM27LS02PCB AM27LS02/BEA AM27LS02/BFA
Description Standard SRAM, 16X4, 65ns, TTL, CQCC20, CERAMIC, LCC-20 Standard SRAM, 16X4, 55ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 Standard SRAM, 16X4, 55ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 Standard SRAM, 16X4, 55ns, TTL, PDIP16, PLASTIC, DIP-16 Standard SRAM, 16X4, 55ns, TTL, PDIP16, PLASTIC, DIP-16 Standard SRAM, 16X4, 65ns, TTL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 Standard SRAM, 16X4, 65ns, TTL, CDFP16, CERAMIC, FP-16
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code QLCC DIP DIP DIP DIP DIP DFP
package instruction QCCN, LCC20,.35SQ DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DFP, FL16,.3
Contacts 20 16 16 16 16 16 16
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A001.A.2.C EAR99 EAR99 EAR99 EAR99 3A001.A.2.C 3A001.A.2.C
Maximum access time 65 ns 55 ns 55 ns 55 ns 55 ns 65 ns 65 ns
JESD-30 code S-CQCC-N20 R-GDIP-T16 R-GDIP-T16 R-PDIP-T16 R-PDIP-T16 R-GDIP-T16 R-GDFP-F16
JESD-609 code e0 e0 e0 e0 e0 e0 e0
length 8.89 mm 19.431 mm 19.431 mm 19.05 mm 19.05 mm 19.431 mm 10.16 mm
memory density 64 bit 64 bit 64 bit 64 bit 64 bit 64 bit 64 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 4 4 4 4 4 4 4
Number of functions 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1
Number of terminals 20 16 16 16 16 16 16
word count 16 words 16 words 16 words 16 words 16 words 16 words 16 words
character code 16 16 16 16 16 16 16
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 75 °C 75 °C 75 °C 75 °C 125 °C 125 °C
organize 16X4 16X4 16X4 16X4 16X4 16X4 16X4
Output characteristics OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR OPEN-COLLECTOR
Exportable NO NO NO NO NO NO NO
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code QCCN DIP DIP DIP DIP DIP DFP
Encapsulate equivalent code LCC20,.35SQ DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 FL16,.3
Package shape SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.54 mm 5.08 mm 5.08 mm 5.08 mm 5.08 mm 5.08 mm 2.159 mm
Maximum supply voltage (Vsup) 5.5 V 5.25 V 5.25 V 5.25 V 5.25 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.75 V 4.75 V 4.75 V 4.75 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO NO NO NO NO YES
technology TTL TTL TTL TTL TTL TTL TTL
Temperature level MILITARY COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE FLAT
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm
Terminal location QUAD DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 8.89 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 6.731 mm
Maker AMD - - AMD AMD AMD AMD
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