CTLSH1-40M322
SURFACE MOUNT
HIGH CURRENT, LOW VF
SILICON SCHOTTKY RECTIFIER
w w w. c e n t r a l s e m i . c o m
DESCRIPTION:
The CENTRAL SEMICONDUCTOR CTLSH1-40M322
is a low VF Schottky rectifier designed for applications
where small size and operational efficiency are prime
requirements. With a maximum power dissipation of
1.45W, and a very small package footprint
(approximately equal to the SOT-363), this Tiny
Leadless Module (TLM) is capable of dissipating up to
4 times the power of similar devices in a comparable
surface mount package.
MARKING CODE: CBA
FEATURES:
•
High Current (IF=1.0A)
•
Low Forward Voltage Drop (VF=0.55V MAX @ 1.0A)
•
High Thermal Efficiency
SYMBOL
VRRM
IF
IFRM
IFSM
PD
TJ, Tstg
Θ
JA
40
1.0
3.5
10
1.45
-65 to +150
86.2
UNITS
V
A
A
A
W
°C
°C/W
TLM322 CASE
• Device is
Halogen Free
by design
APPLICATIONS:
•
DC/DC Converters
•
Reverse Battery Protection
•
Battery powered devices including Cell Phones,
PDAs, Digital Cameras, MP3 Players, etc.
MAXIMUM RATINGS:
(TA=25°C)
Peak Repetitive Reverse Voltage
Continuous Forward Current
Peak Repetitive Forward Current, tp<1.0ms
Peak Forward Surge Current, tp=8.0ms
Power Dissipation (Note 1)
Operating and Storage Junction Temperature
Thermal Resistance (Note 1)
ELECTRICAL CHARACTERISTICS:
(TA=25°C unless otherwise noted)
SYMBOL
TEST CONDITIONS
MIN
TYP
IR
IR
IR
IR
IR
BVR
VF
VF
VF
VF
CJ
trr
VR=5.0V
VR=8.0V
VR=15V
VR=40V
VR=40V, TA=100°C
IR=100μA
IF=10mA
IF=100mA
IF=500mA
IF=1.0A
VR=4.0V, f=1.0MHz
IF=IR=500mA, Irr=50mA, RL=50Ω
21mm
2
.
MAX
10
20
50
0.2
20
UNITS
μA
μA
μA
mA
mA
V
V
V
V
V
pF
ns
40
0.29
0.36
0.45
0.55
50
15
Notes: (1) FR-4 Epoxy PC Board with copper mounting pad area of
R4 (19-February 2010)
CTLSH1-40M322
SURFACE MOUNT
HIGH CURRENT, LOW VF
SILICON SCHOTTKY RECTIFIER
TLM322 CASE - MECHANICAL OUTLINE
SUGGESTED MOUNTING PADS
For Maximum Power Dissipation
(Dimensions in mm)
PIN CONFIGURATION
For standard mounting refer
to TLM322 Package Details
LEAD CODE:
1) Cathode
2) Anode
3) Anode
MARKING CODE: CBA
R4 (19-February 2010)
w w w. c e n t r a l s e m i . c o m
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