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S72NS512RE0KHFG03

Description
Memory Circuit, 32MX16, CMOS, PBGA128, 12 X 12 MM, FBGA-128
Categorystorage    storage   
File Size619KB,13 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric View All

S72NS512RE0KHFG03 Overview

Memory Circuit, 32MX16, CMOS, PBGA128, 12 X 12 MM, FBGA-128

S72NS512RE0KHFG03 Parametric

Parameter NameAttribute value
MakerSPANSION
Parts packaging codeBGA
package instructionTFBGA,
Contacts128
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresDRAM IS ORGANISED AS 16M X 16
JESD-30 codeS-PBGA-B128
length12 mm
memory density536870912 bit
Memory IC TypeMEMORY CIRCUIT
memory width16
Number of functions1
Number of terminals128
word count33554432 words
character code32000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize32MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeSQUARE
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Certification statusNot Qualified
Maximum seat height1.05 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.65 mm
Terminal locationBOTTOM
width12 mm
S72NS-R Based MCPs
MirrorBit
®
Flash Memory and DRAM
128/256/512 Mb (8/16/32 M x 16 bit), 1.8 Volt-only, Multiplexed
Simultaneous Read/Write, Burst Mode Flash Memory
128/256 Mb (8/16 M x 16 bit) DDR DRAM on Split Bus
Data Sheet
(Advance Information)
S72NS-R Based MCPs Cover Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See
Notice On Data Sheet Designations
for definitions.
Publication Number
S72NS-R_00
Revision
07
Issue Date
May 10, 2010
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