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9403ASDCQR

Description
16 X 4 OTHER FIFO, CDIP24
Categorystorage    storage   
File Size943KB,20 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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9403ASDCQR Overview

16 X 4 OTHER FIFO, CDIP24

9403ASDCQR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDIP, DIP24,.3
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum clock frequency (fCLK)19 MHz
JESD-30 codeR-GDIP-T24
JESD-609 codee0
memory density64 bi
Memory IC TypeOTHER FIFO
memory width4
Number of functions1
Number of terminals24
word count16 words
character code16
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16X4
ExportableYES
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL/SERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Maximum seat height5.715 mm
Maximum slew rate0.17 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm

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Description 16 X 4 OTHER FIFO, CDIP24 16 X 4 OTHER FIFO, CDIP24 16X4 OTHER FIFO, CDIP24, CERAMIC, DIP-24 16 X 4 OTHER FIFO, CQCC28 IC 16 X 4 OTHER FIFO, CQCC28, CERAMIC, LCC-28, FIFO IC 16 X 4 OTHER FIFO, CQCC28, CERAMIC, LCC-28, FIFO 16 X 4 OTHER FIFO, CDIP24 16 X 4 OTHER FIFO, CQCC28
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction DIP, DIP24,.3 DIP, DIP24,.6 DIP, DIP24,.6 QCCN, LCC28,.45SQ QCCN, QCCN, DIP, DIP24,.3 QCCN, LCC28,.45SQ
Reach Compliance Code unknow unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
JESD-30 code R-GDIP-T24 R-GDIP-T24 R-GDIP-T24 S-CQCC-N28 S-CQCC-N28 S-CQCC-N28 R-GDIP-T24 S-CQCC-N28
memory density 64 bi 64 bit 64 bit 64 bit 64 bit 64 bit 64 bit 64 bit
memory width 4 4 4 4 4 4 4 4
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 24 24 24 28 28 28 24 28
word count 16 words 16 words 16 words 16 words 16 words 16 words 16 words 16 words
character code 16 16 16 16 16 16 16 16
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 125 °C 125 °C 125 °C 70 °C 125 °C 70 °C
organize 16X4 16X4 16X4 16X4 16X4 16X4 16X4 16X4
Exportable YES YES YES YES YES YES YES YES
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP DIP DIP QCCN QCCN QCCN DIP QCCN
Package shape RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE SQUARE RECTANGULAR SQUARE
Package form IN-LINE IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER CHIP CARRIER IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL/SERIAL PARALLEL/SERIAL PARALLEL/SERIAL PARALLEL/SERIAL PARALLEL/SERIAL PARALLEL/SERIAL PARALLEL/SERIAL PARALLEL/SERIAL
Maximum seat height 5.715 mm 4.572 mm 4.572 mm 1.93 mm 1.93 mm 1.93 mm 5.715 mm 1.93 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO YES YES YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL MILITARY MILITARY MILITARY COMMERCIAL MILITARY COMMERCIAL
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE NO LEAD NO LEAD NO LEAD THROUGH-HOLE NO LEAD
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL QUAD QUAD QUAD DUAL QUAD
width 7.62 mm 15.24 mm 15.24 mm 11.43 mm 11.43 mm 11.43 mm 7.62 mm 11.43 mm
Is it Rohs certified? incompatible incompatible incompatible incompatible - - incompatible incompatible
Maximum clock frequency (fCLK) 19 MHz 19 MHz 13 MHz 13 MHz - - 13 MHz 19 MHz
JESD-609 code e0 e0 e0 e0 - - e0 e0
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO - - OTHER FIFO OTHER FIFO
Encapsulate equivalent code DIP24,.3 DIP24,.6 DIP24,.6 LCC28,.45SQ - - DIP24,.3 LCC28,.45SQ
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V - - 5 V 5 V
Maximum slew rate 0.17 mA 0.17 mA 0.17 mA 0.17 mA - - 0.17 mA 0.17 mA
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED
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