R5F21334TNFP_11 datasheet, PDF

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R5F21334TNFP_11: DescriptionThe R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO); File Size418KB，51 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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R5F21334TNFP_11 Overview

The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO)

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R8C/33T Group

RENESAS MCU

R01DS0046EJ0110

Rev.1.10

Apr 26, 2011

1.1

Overview

Features

The R8C/33T Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions

for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high

speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.

Power consumption is low, and the supported operating modes allow additional power control. These MCUs are

designed to maximize EMI/EMS performance.

Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of

system components.

The R8C/33T Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function.

1.1.1

Applications

Electronic household appliances, office equipment, audio equipment, consumer equipment, etc.

R01DS0046EJ0110 Rev.1.10

Apr 26, 2011

Page 1 of 47

R5F21334TNFP_11 Related Products

	R5F21334TNFP_11	R5F21334TNFP	R5F21334TNXXXFP	R5F21335TNXXXFP	R5F21336TNXXXFP	R5F21335TNFP	R5F21336TNFP
Description	The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO)	The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO)	The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO)	The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO)	The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO)	The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO)	The R8C/33T Group has data flash (1 KB 脳 4 blocks) with the background operation (BGO)
Maker	-	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Parts packaging code	-	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	-	LQFP, QFP32,.35SQ,32	LQFP, QFP32,.35SQ,32	LQFP, QFP32,.35SQ,32	LQFP, QFP32,.35SQ,32	LQFP, QFP32,.35SQ,32	7 X 7 MM, 0.80 MM PITCH, PLASTIC, LQFP-32
Contacts	-	32	32	32	32	32	32
Reach Compliance Code	-	compli	compli	compli	compli	compli	compli
Has ADC	-	YES	YES	YES	YES	YES	YES
Other features	-	ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 5 MHZ	ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 5 MHZ	ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 5 MHZ	ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 5 MHZ	ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 5 MHZ	ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 5 MHZ
bit size	-	8	8	8	8	8	8
maximum clock frequency	-	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz
DAC channel	-	NO	NO	NO	NO	NO	NO
DMA channel	-	NO	NO	NO	NO	NO	NO
JESD-30 code	-	S-PQFP-G32	S-PQFP-G32	S-PQFP-G32	S-PQFP-G32	S-PQFP-G32	S-PQFP-G32
length	-	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm
Number of I/O lines	-	28	28	28	28	28	28
Number of terminals	-	32	32	32	32	32	32
Maximum operating temperature	-	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C	-20 °C
PWM channel	-	YES	YES	YES	YES	YES	YES
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP
Encapsulate equivalent code	-	QFP32,.35SQ,32	QFP32,.35SQ,32	QFP32,.35SQ,32	QFP32,.35SQ,32	QFP32,.35SQ,32	QFP32,.35SQ,32
Package shape	-	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
power supply	-	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V	2/5 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	-	1536	1536	2048	2560	2048	2560
rom(word)	-	16384	16384	24576	32768	24576	32768
ROM programmability	-	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	-	1.7 mm	1.7 mm	1.7 mm	1.7 mm	1.7 mm	1.7 mm
speed	-	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz	20 MHz
Maximum slew rate	-	15 mA	15 mA	15 mA	15 mA	15 mA	15 mA
Maximum supply voltage	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage	-	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	-	YES	YES	YES	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal form	-	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	-	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
width	-	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm
uPs/uCs/peripheral integrated circuit type	-	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER

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