EEWORLDEEWORLDEEWORLD

Part Number

Search

MT8870DE-1

Description
DTMF Signaling Circuit, CMOS, PDIP18, DIP-18
CategoryWireless rf/communication    Telecom circuit   
File Size137KB,17 Pages
ManufacturerDynex
Websitehttp://www.dynexsemi.com/
Download Datasheet Parametric Compare View All

MT8870DE-1 Overview

DTMF Signaling Circuit, CMOS, PDIP18, DIP-18

MT8870DE-1 Parametric

Parameter NameAttribute value
MakerDynex
Parts packaging codeDIP
package instructionDIP,
Contacts18
Reach Compliance Codeunknown
JESD-30 codeR-PDIP-T18
length22.86 mm
Number of functions1
Number of terminals18
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Maximum seat height5.33 mm
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Telecom integrated circuit typesDTMF SIGNALING CIRCUIT
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
®
ISO
2
-CMOS
MT8870D/MT8870D-1
Integrated DTMF Receiver
Features
Complete DTMF Receiver
Low power consumption
Internal gain setting amplifier
Adjustable guard time
Central office quality
Power-down mode
Inhibit mode
Backward compatible with
MT8870C/MT8870C-1
ISSUE 5
March 1997
Ordering Information
MT8870DE/DE-1 18 Pin Plastic DIP
MT8870DS/DS-1 18 Pin SOIC
MT8870DN/DN-1 20 Pin SSOP
-40
°C
to +85
°C
Description
The MT8870D/MT8870D-1 is a complete DTMF
receiver integrating both the bandsplit filter and
digital decoder functions. The filter section uses
switched capacitor techniques for high and low
group filters; the decoder uses digital counting
techniques to detect and decode all 16 DTMF tone-
pairs into a 4-bit code. External component count is
minimized by on chip provision of a differential input
amplifier, clock oscillator and latched three-state bus
interface.
Applications
Receiver system for British Telecom (BT) or
CEPT Spec (MT8870D-1)
Paging systems
Repeater systems/mobile radio
Credit card systems
Remote control
Personal computers
Telephone answering machine
VDD
VSS
VRef
INH
PWDN
Bias
Circuit
VRef
Buffer
Q1
Chip Chip
Power Bias
IN +
IN -
GS
Dial
Tone
Filter
High Group
Filter
Zero Crossing
Detectors
Low Group
Filter
Digital
Detection
Algorithm
Code
Converter
and Latch
Q2
Q3
Q4
to all
Chip
Clocks
St
GT
Steering
Logic
OSC1
OSC2
St/GT
ESt
STD
TOE
Figure 1 - Functional Block Diagram
4-11

MT8870DE-1 Related Products

MT8870DE-1 MT8870DE MT8870DN MT8870DN-1 MT8870DS MT8870DS-1
Description DTMF Signaling Circuit, CMOS, PDIP18, DIP-18 DTMF Signaling Circuit, CMOS, PDIP18, DIP-18 DTMF Signaling Circuit, CMOS, PDSO20, SSOP-20 DTMF Signaling Circuit, CMOS, PDSO20, SSOP-20 DTMF Signaling Circuit, CMOS, PDSO18, SOIC-18 DTMF Signaling Circuit, CMOS, PDSO18, SOIC-18
Parts packaging code DIP DIP SSOP SSOP SOIC SOIC
package instruction DIP, DIP, SSOP, SSOP, SOP, SOP,
Contacts 18 18 20 20 18 18
Reach Compliance Code unknown unknown unknown unknown unknown unknown
JESD-30 code R-PDIP-T18 R-PDIP-T18 R-PDSO-G20 R-PDSO-G20 R-PDSO-G18 R-PDSO-G18
length 22.86 mm 22.86 mm 7.2 mm 7.2 mm 11.55 mm 11.55 mm
Number of functions 1 1 1 1 1 1
Number of terminals 18 18 20 20 18 18
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP SSOP SSOP SOP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.33 mm 5.33 mm 2 mm 2 mm 2.65 mm 2.65 mm
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Telecom integrated circuit types DTMF SIGNALING CIRCUIT DTMF SIGNALING CIRCUIT DTMF SIGNALING CIRCUIT DTMF SIGNALING CIRCUIT DTMF SIGNALING CIRCUIT DTMF SIGNALING CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING
Terminal pitch 2.54 mm 2.54 mm 0.635 mm 0.635 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
width 7.62 mm 7.62 mm 5.3 mm 5.3 mm 7.493 mm 7.493 mm
Maker Dynex - Dynex Dynex Dynex Dynex

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 12  1413  2239  1228  1596  1  29  46  25  33 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号