Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
µMAX
Junction-to-Ambient Thermal Resistance (θ
JA
) ......113.1°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ................42°C/W
QSOP
Junction-to-Ambient Thermal Resistance (θ
JA
) ......103.7°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ................37°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
CC
= 5V, V
GND
= 0V, MAX9925/MAX9927 gain setting = 1V/V, Mode A1, V
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FPGA/CPLD
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