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SMLJ33A

Description
Trans Voltage Suppressor Diode, 3000W, 33V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, PLASTIC, SMCJ, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size416KB,8 Pages
ManufacturerMicro Commercial Components (MCC)
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SMLJ33A Overview

Trans Voltage Suppressor Diode, 3000W, 33V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, PLASTIC, SMCJ, 2 PIN

SMLJ33A Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicro Commercial Components (MCC)
Parts packaging codeDO-214AB
package instructionPLASTIC, SMCJ, 2 PIN
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresLOW INDUCTANCE, UL RECOGNIZED
Maximum breakdown voltage40.6 V
Minimum breakdown voltage36.7 V
Breakdown voltage nominal value38.65 V
Maximum clamping voltage53.3 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95 codeDO-214AB
JESD-30 codeR-PDSO-C2
JESD-609 codee0
Maximum non-repetitive peak reverse power dissipation3000 W
Number of components1
Number of terminals2
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)240
polarityUNIDIRECTIONAL
Certification statusNot Qualified
Maximum repetitive peak reverse voltage33 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
MCC
Features
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  omponents
21201 Itasca Street Chatsworth

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SMLJ5.0
THRU
SMLJ170CA
Transient
Voltage Suppressor
5.0 to 170 Volts
3000 Watt
DO-214AB
(SMLJ) (LEAD FRAME)
G
For surface mount application in order to optimize board space
Low inductance
Low profile package
Built-in strain relief
Glass passivated junction
Excellent clamping capability
Repetition Rate( duty cycle): 0.5%
Fast response time: typical less than 1ps from 0V to BV min
Typical I
D
less than 1uA above 10V
High temperature soldering: 250 C/10 seconds at terminals
Plastic package has Underwrites Laboratory Flammability
Classification 94V-O
o
H
Mechanical Data
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D
CASE: JEDEC DO-214AB molded plastic body over
passivated junction
E
A
C
B
F
DIMENSIONS
INCHES
MIN
.079
.115
.002
.006
.030
..305
.260
.220
MM
MIN
2.00
2.92
0.051
0.152
0.76
7.75
6.60
5.59
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Terminals: solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes positive end( cathode) except
Bi-directional types.
DIM
A
B
C
D
E
F
G
H
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Standard packaging: 16mm tape per ( EIA 481).
Weight: 0.007 ounce, 0.21 gram
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Peak Pulse Current on
I
PPM
See Table 1 Amps
10/1000us
waveform(Note1, Fig3)
Peak Pulse Power
P
PPM
Minimum Watts
Disspation on 10/1000us
3000
waveform(Note1,2,Fig1)
Peak forward surge
I
FSM)
200.0
Amps
current (JEDEC
Method) (Note 2,3)
Operation And Storage
T
J
,
-55
o
C to
Temperature Range
T
STG
+150
o
C
MAX
.103
.121
.008
.012
.050
.320
.280
.245
MAX
2.62
3.07
0.203
0.305
1.27
8.13
7.11
6.22
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.280"
0.121”
0.060”
NOTES:
o
1.
Non-repetitive current pulse per Fig.3 and derated above TA=25 C per Fig.2.
2
2.
Mounted on 8.0mm copper pads to each terminal.
3.
8.3ms, single half sine-wave or equivalent square wave, duty cycle=4 pulses per. Minutes maximum.
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