SE556F datasheet, PDF - EEWORLD Datasheet

SE556F: DescriptionAnalog Waveform Generation Function, BIPolar, CDIP14,; CategoryAnalog mixed-signal IC The signal circuit; File Size127KB，2 Pages; ManufacturerGeneral Electric Solid State

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SE556F Overview

Analog Waveform Generation Function, BIPolar, CDIP14,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	General Electric Solid State
package instruction	DIP, DIP14,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDIP-T14
JESD-609 code	e0
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
Certification status	Not Qualified
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	SE556F	NE556N	NE556F	NE556A
Description	Analog Waveform Generation Function, BIPolar, CDIP14,	Analog Waveform Generation Function, BIPolar, PDIP14	Analog Waveform Generation Function, BIPolar, CDIP14	Analog Waveform Generation Function, BIPolar, PDIP14
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	R-XDIP-T14	R-PDIP-T14	R-XDIP-T14	R-PDIP-T14
JESD-609 code	e0	e0	e0	e0
Number of terminals	14	14	14	14
Maximum operating temperature	125 °C	70 °C	70 °C	70 °C
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maker	General Electric Solid State	-	General Electric Solid State	General Electric Solid State

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