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NE556F

Description
Analog Waveform Generation Function, BIPolar, CDIP14
CategoryAnalog mixed-signal IC    The signal circuit   
File Size127KB,2 Pages
ManufacturerGeneral Electric Solid State
Download Datasheet Parametric Compare View All

NE556F Overview

Analog Waveform Generation Function, BIPolar, CDIP14

NE556F Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerGeneral Electric Solid State
package instructionDIP, DIP14,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T14
JESD-609 codee0
Number of terminals14
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5/15 V
Certification statusNot Qualified
surface mountNO
technologyBIPOLAR
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

NE556F Related Products

NE556F NE556N SE556F NE556A
Description Analog Waveform Generation Function, BIPolar, CDIP14 Analog Waveform Generation Function, BIPolar, PDIP14 Analog Waveform Generation Function, BIPolar, CDIP14, Analog Waveform Generation Function, BIPolar, PDIP14
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown unknown unknown
JESD-30 code R-XDIP-T14 R-PDIP-T14 R-XDIP-T14 R-PDIP-T14
JESD-609 code e0 e0 e0 e0
Number of terminals 14 14 14 14
Maximum operating temperature 70 °C 70 °C 125 °C 70 °C
Package body material CERAMIC PLASTIC/EPOXY CERAMIC PLASTIC/EPOXY
encapsulated code DIP DIP DIP DIP
Encapsulate equivalent code DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE
power supply 5/15 V 5/15 V 5/15 V 5/15 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO NO NO
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level COMMERCIAL COMMERCIAL MILITARY COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
Maker General Electric Solid State - General Electric Solid State General Electric Solid State
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