Analog Waveform Generation Function, BIPolar, PDIP14
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | General Electric Solid State |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T14 |
| JESD-609 code | e0 |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| NE556A | NE556N | SE556F | NE556F | |
|---|---|---|---|---|
| Description | Analog Waveform Generation Function, BIPolar, PDIP14 | Analog Waveform Generation Function, BIPolar, PDIP14 | Analog Waveform Generation Function, BIPolar, CDIP14, | Analog Waveform Generation Function, BIPolar, CDIP14 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDIP-T14 | R-PDIP-T14 | R-XDIP-T14 | R-XDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of terminals | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 70 °C | 70 °C | 125 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maker | General Electric Solid State | - | General Electric Solid State | General Electric Solid State |
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