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HUM2015CE3

Description
Pin Diode, Silicon, HERMETIC SEALED PACKAGE-1
CategoryDiscrete semiconductor    diode   
File Size349KB,5 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric Compare View All

HUM2015CE3 Overview

Pin Diode, Silicon, HERMETIC SEALED PACKAGE-1

HUM2015CE3 Parametric

Parameter NameAttribute value
MakerMicrosemi
package instructionO-MUPM-X1
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresHIGH RELIABILITY
applicationSWITCHING
Shell connectionCATHODE
ConfigurationSINGLE
Maximum diode capacitance4 pF
Diode component materialsSILICON
Maximum diode forward resistance0.2 Ω
Diode typePIN DIODE
JESD-30 codeO-MUPM-X1
Minority carrier nominal lifetime30 µs
Number of components1
Number of terminals1
Package body materialMETAL
Package shapeROUND
Package formPOST/STUD MOUNT
surface mountNO
technologyPOSITIVE-INTRINSIC-NEGATIVE
Terminal formUNSPECIFIED
Terminal locationUPPER
HUM2001/HUM2020 SERIES
Pin Diode High Power Stud
DESCRIPTION
KEY FEATURES
High Power Stud Mount Package.
High Zero Bias Impedance
Very Low Inductance and
Capacitance.
No Internal Lead Straps.
Small Mechanical Outline.
APPLICATIONS/BENEFITS
MRI Applications.
High Power Antenna Switching.
VOLTAGE RATING [25°C]
Reverse
Voltage
(V
R
) – Volts
I
R
= 10µA
100V
Part type
WWW .
Microsemi
.C
OM
With high isolation, low loss, and low distortion characteristics, this
Microsemi Power PIN diode is perfect for the high power switching
applications where size and power handling capability are critical.
Its advantages also include the low forward bias resistance and high zero
bias impedance that are essential for low loss, high isolation and wide
bandwidth performance.
Hermetically sealed, SOGO passivated PIN chips with full-faced metallurgical
bonds on both sides to achieve high reliability and high surge capability.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
HUM2001
HUM2005
HUM2010
HUM2015
HUM2020
Style “D”
Insulated Stud
Style “C”
Stud
Style “B”
Round Axial Leads
Style “SM”
Melf
500V
1000V
1500V
2000V
Maximum Ratings @ 25ºC
(UNLESS OTHERWISE SPECIFIED)
Parameter
Maximum Reverse
Voltage
Average Power
Dissipation
@ Stud =50°C
Non-Repetitive
Sinusoidal Surge
Current (8.3 ms)
Storage
Temperature
Range
Operating
Temperature
Range
Thermal resistance
Junction-to Case
“C” Stud only
Symbol
T
RWM
I
O
I
T
STG
T
STG
R
θ
JC
HUM2001
100
13
100
-65 to
+175
-55 to
+150
7.5
HUM2005
500
13
100
-65 to
+175
-55 to
+150
7.5
TYPE
HUM2010
HUM2015
1000
13
100
-65 to
+175
-55 to
+150
7.5
1500
13
100
-65 to
+175
-55 to
+150
7.5
HUM2020
2000
13
100
-65 to
+175
-55 to
+150
7.5
Unit
V
W
A
°C
HUM2010-2020
HUM2010-2020
°C
°C/W
Copyright
2000
MSCXXXX.PDF 2002-08-08
Microsemi
Page 1

HUM2015CE3 Related Products

HUM2015CE3 HUM2020DE3 HUM2001BE3 HUM2001CE3 HUM2005SME3 HUM2005BE3 HUM2010SME3
Description Pin Diode, Silicon, HERMETIC SEALED PACKAGE-1 Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2 Pin Diode, Silicon, HERMETIC SEALED, AXIAL PACKAGE-2 Pin Diode, Silicon, HERMETIC SEALED PACKAGE-1 Pin Diode, Silicon, HERMETIC SEALED, MELF-2 Pin Diode, Silicon, HERMETIC SEALED, AXIAL PACKAGE-2 Pin Diode, Silicon, HERMETIC SEALED, MELF-2
package instruction O-MUPM-X1 O-MXPM-X2 O-XALF-W2 O-MUPM-X1 O-LELF-R2 O-XALF-W2 O-LELF-R2
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Other features HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY
application SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING
Shell connection CATHODE ISOLATED ISOLATED CATHODE ISOLATED ISOLATED ISOLATED
Configuration SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
Maximum diode capacitance 4 pF 4 pF 4 pF 4 pF 4 pF 4 pF 4 pF
Diode component materials SILICON SILICON SILICON SILICON SILICON SILICON SILICON
Maximum diode forward resistance 0.2 Ω 0.2 Ω 0.2 Ω 0.2 Ω 0.2 Ω 0.2 Ω 0.2 Ω
Diode type PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE
JESD-30 code O-MUPM-X1 O-MXPM-X2 O-XALF-W2 O-MUPM-X1 O-LELF-R2 O-XALF-W2 O-LELF-R2
Minority carrier nominal lifetime 30 µs 30 µs 30 µs 30 µs 30 µs 30 µs 30 µs
Number of components 1 1 1 1 1 1 1
Number of terminals 1 2 2 1 2 2 2
Package body material METAL METAL UNSPECIFIED METAL GLASS UNSPECIFIED GLASS
Package shape ROUND ROUND ROUND ROUND ROUND ROUND ROUND
Package form POST/STUD MOUNT POST/STUD MOUNT LONG FORM POST/STUD MOUNT LONG FORM LONG FORM LONG FORM
surface mount NO NO NO NO YES NO YES
technology POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE
Terminal form UNSPECIFIED UNSPECIFIED WIRE UNSPECIFIED WRAP AROUND WIRE WRAP AROUND
Terminal location UPPER UNSPECIFIED AXIAL UPPER END AXIAL END
Base Number Matches - 1 - - 1 1 1
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