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Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> PCI1410APGEG4
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PCI1410APGEG4

Description
PCMCIA BUS CONTROLLER, PQFP144, PLASTIC, LQFP-144
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB，141 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Environmental Compliance  
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PCI1410APGEG4 Overview

PCMCIA BUS CONTROLLER, PQFP144, PLASTIC, LQFP-144

PCI1410APGEG4 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerRochester Electronics
Parts packaging codeQFP
package instructionLFQFP,
Contacts144
Reach Compliance Codeunknown
Address bus width32
Bus compatibilityPCI
maximum clock frequency33.33 MHz
External data bus width32
JESD-30 codeS-PQFP-G144
JESD-609 codee4
length20 mm
Humidity sensitivity level2
Number of terminals144
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
Certification statusCOMMERCIAL
Maximum seat height1.6 mm
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width20 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCMCIA

PCI1410APGEG4 Preview

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PCI1410A GHK/GGU/PGE
PC Card Controllers
Data Manual
NOTE
Designing with this device may require extensive support. Before incorporating this device into
a design, customers should contact TI or an Authorized TI Distributor.
2000
PCIBus Solutions
SCPS057
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright
2000, Texas Instruments Incorporated
Contents
Section
1
Title
Page
1–1
1–1
1–1
1–2
1–2
1–2
2–1
3–1
3–1
3–2
3–2
3–2
3–2
3–3
3–3
3–3
3–4
3–5
3–6
3–6
3–7
3–7
3–8
3–8
3–10
3–10
3–11
3–11
3–11
3–13
3–14
3–15
3–15
3–16
3–17
3–18
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3
Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Terminal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Feature/Protocol Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1
Power-Supply Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2
I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3
Clamping Voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4
Peripheral Component Interconnect (PCI) Interface . . . . . . . . . . . . . .
3.4.1
PCI Bus Lock (LOCK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.2
Loading Subsystem Identification . . . . . . . . . . . . . . . . . . . . .
3.5
PC Card Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.1
PC Card Insertion/Removal and Recognition . . . . . . . . . . .
3.5.2
P
2
C Power-Switch Interface (TPS2211) . . . . . . . . . . . . . . .
3.5.3
Zoomed-Video Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.4
Ultrazoomed Video . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.5
Internal Ring Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.6
Integrated Pullup Resistors for PC Card Interface . . . . . . .
3.5.7
SPKROUT and CAUDPWM Usage . . . . . . . . . . . . . . . . . . .
3.5.8
LED Socket Activity Indicators . . . . . . . . . . . . . . . . . . . . . . . .
3.5.9
PC Card-16 Distributed DMA Support . . . . . . . . . . . . . . . . .
3.5.10
PC Card-16 PC/PCI DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.11
CardBus Socket Registers . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6
Serial Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.1
Serial Bus-Interface Implementation . . . . . . . . . . . . . . . . . . .
3.6.2
Serial Bus-Interface Protocol . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.3
Serial Bus EEPROM Application . . . . . . . . . . . . . . . . . . . . . .
3.6.4
Accessing Serial Bus Devices Through Software . . . . . . . .
3.7
Programmable Interrupt Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.1
PC Card Functional and Card Status Change Interrupts .
3.7.2
Interrupt Masks and Flags . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.3
Using Parallel IRQ Interrupts . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.4
Using Parallel PCI Interrupts . . . . . . . . . . . . . . . . . . . . . . . . .
2
3
iii
4
3.7.5
Using Serialized IRQSER Interrupts . . . . . . . . . . . . . . . . . . .
3.7.6
SMI Support in the PCI1410A Device . . . . . . . . . . . . . . . . . .
3.8
Power-Management Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.1
Clock-Run Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.2
CardBus PC Card Power Management . . . . . . . . . . . . . . . .
3.8.3
16-Bit PC Card Power Management . . . . . . . . . . . . . . . . . . .
3.8.4
Suspend Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.5
Requirements for Suspend Mode . . . . . . . . . . . . . . . . . . . . .
3.8.6
Ring Indicate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.7
PCI Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.8
CardBus Device Class Power Management . . . . . . . . . . . .
3.8.9
ACPI Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.10
Master List of PME Context Bits and
Global Reset-Only Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PC Card Controller Programming Model . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1
PCI Configuration Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2
Vendor ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3
Device ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.4
Command Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5
Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.6
Revision ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.7
PCI Class Code Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.8
Cache Line Size Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.9
Latency Timer Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.10 Header Type Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.11 BIST Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.12 CardBus Socket/ExCA Base-Address Register . . . . . . . . . . . . . . . . . .
4.13 Capability Pointer Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.14 Secondary Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.15 PCI Bus Number Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.16 CardBus Bus Number Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.17 Subordinate Bus Number Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.18 CardBus Latency Timer Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.19 Memory Base Registers 0, 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.20 Memory Limit Registers 0, 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.21 I/O Base Registers 0, 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.22 I/O Limit Registers 0, 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.23 Interrupt Line Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.24 Interrupt Pin Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.25 Bridge Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.26 Subsystem Vendor ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.27 Subsystem ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.28 PC Card 16-Bit I/F Legacy-Mode Base-Address Register . . . . . . . . .
4.29 System Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3–18
3–18
3–19
3–19
3–19
3–19
3–20
3–21
3–21
3–22
3–23
3–23
3–24
4–1
4–1
4–2
4–2
4–3
4–4
4–5
4–5
4–5
4–6
4–6
4–6
4–7
4–7
4–8
4–9
4–9
4–9
4–10
4–10
4–11
4–11
4–12
4–12
4–13
4–14
4–15
4–15
4–15
4–16
iv
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PCI1410APGEG4 Related Products

PCI1410APGEG4 PCI1410APGE PCI1410AGGU PCI1410AGHK
Description PCMCIA BUS CONTROLLER, PQFP144, PLASTIC, LQFP-144 PCMCIA BUS CONTROLLER, PQFP144, PLASTIC, LQFP-144 PCMCIA BUS CONTROLLER, PBGA144, PLASTIC, BGA-144 PCMCIA BUS CONTROLLER, PBGA209, PLASTIC, BGA-209
Is it lead-free? Lead free Lead free Contains lead Contains lead
Maker Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
Parts packaging code QFP QFP BGA BGA
package instruction LFQFP, LFQFP, PLASTIC, BGA-144 PLASTIC, BGA-209
Contacts 144 144 144 209
Reach Compliance Code unknown unknown unknown unknown
Address bus width 32 32 32 32
Bus compatibility PCI PCI PCI PCI
maximum clock frequency 33.33 MHz 33.33 MHz 33.33 MHz 33.33 MHz
External data bus width 32 32 32 32
JESD-30 code S-PQFP-G144 S-PQFP-G144 S-PBGA-B144 S-PBGA-B209
JESD-609 code e4 e4 e0 e0
length 20 mm 20 mm 12 mm 16 mm
Humidity sensitivity level 2 2 3 3
Number of terminals 144 144 144 209
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP LFQFP LFBGA LFBGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 260 260 220 220
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 1.6 mm 1.6 mm 1.4 mm 1.4 mm
Maximum supply voltage 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage 3 V 3 V 3 V 3 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD TIN LEAD TIN LEAD
Terminal form GULL WING GULL WING BALL BALL
Terminal pitch 0.5 mm 0.5 mm 0.8 mm 0.8 mm
Terminal location QUAD QUAD BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 20 mm 20 mm 12 mm 16 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCMCIA BUS CONTROLLER, PCMCIA BUS CONTROLLER, PCMCIA BUS CONTROLLER, PCMCIA

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Shortcut:   A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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  4. XMC4000 Overview
  5. Preparation of solar cell materials
  6. Smart desk lamp made with single chip microcomputer
  7. Selection of motor capacity
  8. SPB series intelligent digital (light column) display alarm instrument
  9. The Future of Business Intelligence and Its Role in Enterprise Performance Management
  10. Study on the working stability of switching power converter in test equipment

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