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Datasheet> All Categories > The embedded processor and controller> Microcontrollers and processors> PCI1410AGHK
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PCI1410AGHK

Description
PCMCIA BUS CONTROLLER, PBGA209, PLASTIC, BGA-209
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB，141 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Download Datasheet Parametric Compare View All

PCI1410AGHK Overview

PCMCIA BUS CONTROLLER, PBGA209, PLASTIC, BGA-209

PCI1410AGHK Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
MakerRochester Electronics
Parts packaging codeBGA
package instructionPLASTIC, BGA-209
Contacts209
Reach Compliance Codeunknown
Address bus width32
Bus compatibilityPCI
maximum clock frequency33.33 MHz
External data bus width32
JESD-30 codeS-PBGA-B209
JESD-609 codee0
length16 mm
Humidity sensitivity level3
Number of terminals209
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)220
Certification statusCOMMERCIAL
Maximum seat height1.4 mm
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width16 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCMCIA

PCI1410AGHK Preview

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PCI1410A GHK/GGU/PGE
PC Card Controllers
Data Manual
NOTE
Designing with this device may require extensive support. Before incorporating this device into
a design, customers should contact TI or an Authorized TI Distributor.
2000
PCIBus Solutions
SCPS057
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright
2000, Texas Instruments Incorporated
Contents
Section
1
Title
Page
1–1
1–1
1–1
1–2
1–2
1–2
2–1
3–1
3–1
3–2
3–2
3–2
3–2
3–3
3–3
3–3
3–4
3–5
3–6
3–6
3–7
3–7
3–8
3–8
3–10
3–10
3–11
3–11
3–11
3–13
3–14
3–15
3–15
3–16
3–17
3–18
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3
Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.5
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Terminal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Feature/Protocol Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1
Power-Supply Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2
I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3
Clamping Voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4
Peripheral Component Interconnect (PCI) Interface . . . . . . . . . . . . . .
3.4.1
PCI Bus Lock (LOCK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.2
Loading Subsystem Identification . . . . . . . . . . . . . . . . . . . . .
3.5
PC Card Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.1
PC Card Insertion/Removal and Recognition . . . . . . . . . . .
3.5.2
P
2
C Power-Switch Interface (TPS2211) . . . . . . . . . . . . . . .
3.5.3
Zoomed-Video Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.4
Ultrazoomed Video . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.5
Internal Ring Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.6
Integrated Pullup Resistors for PC Card Interface . . . . . . .
3.5.7
SPKROUT and CAUDPWM Usage . . . . . . . . . . . . . . . . . . .
3.5.8
LED Socket Activity Indicators . . . . . . . . . . . . . . . . . . . . . . . .
3.5.9
PC Card-16 Distributed DMA Support . . . . . . . . . . . . . . . . .
3.5.10
PC Card-16 PC/PCI DMA . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5.11
CardBus Socket Registers . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6
Serial Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.1
Serial Bus-Interface Implementation . . . . . . . . . . . . . . . . . . .
3.6.2
Serial Bus-Interface Protocol . . . . . . . . . . . . . . . . . . . . . . . . .
3.6.3
Serial Bus EEPROM Application . . . . . . . . . . . . . . . . . . . . . .
3.6.4
Accessing Serial Bus Devices Through Software . . . . . . . .
3.7
Programmable Interrupt Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.1
PC Card Functional and Card Status Change Interrupts .
3.7.2
Interrupt Masks and Flags . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.3
Using Parallel IRQ Interrupts . . . . . . . . . . . . . . . . . . . . . . . . .
3.7.4
Using Parallel PCI Interrupts . . . . . . . . . . . . . . . . . . . . . . . . .
2
3
iii
4
3.7.5
Using Serialized IRQSER Interrupts . . . . . . . . . . . . . . . . . . .
3.7.6
SMI Support in the PCI1410A Device . . . . . . . . . . . . . . . . . .
3.8
Power-Management Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.1
Clock-Run Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.2
CardBus PC Card Power Management . . . . . . . . . . . . . . . .
3.8.3
16-Bit PC Card Power Management . . . . . . . . . . . . . . . . . . .
3.8.4
Suspend Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.5
Requirements for Suspend Mode . . . . . . . . . . . . . . . . . . . . .
3.8.6
Ring Indicate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.7
PCI Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.8
CardBus Device Class Power Management . . . . . . . . . . . .
3.8.9
ACPI Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.10
Master List of PME Context Bits and
Global Reset-Only Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PC Card Controller Programming Model . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1
PCI Configuration Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2
Vendor ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3
Device ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.4
Command Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5
Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.6
Revision ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.7
PCI Class Code Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.8
Cache Line Size Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.9
Latency Timer Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.10 Header Type Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.11 BIST Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.12 CardBus Socket/ExCA Base-Address Register . . . . . . . . . . . . . . . . . .
4.13 Capability Pointer Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.14 Secondary Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.15 PCI Bus Number Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.16 CardBus Bus Number Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.17 Subordinate Bus Number Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.18 CardBus Latency Timer Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.19 Memory Base Registers 0, 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.20 Memory Limit Registers 0, 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.21 I/O Base Registers 0, 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.22 I/O Limit Registers 0, 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.23 Interrupt Line Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.24 Interrupt Pin Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.25 Bridge Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.26 Subsystem Vendor ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.27 Subsystem ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.28 PC Card 16-Bit I/F Legacy-Mode Base-Address Register . . . . . . . . .
4.29 System Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3–18
3–18
3–19
3–19
3–19
3–19
3–20
3–21
3–21
3–22
3–23
3–23
3–24
4–1
4–1
4–2
4–2
4–3
4–4
4–5
4–5
4–5
4–6
4–6
4–6
4–7
4–7
4–8
4–9
4–9
4–9
4–10
4–10
4–11
4–11
4–12
4–12
4–13
4–14
4–15
4–15
4–15
4–16
iv
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PCI1410AGHK Related Products

PCI1410AGHK PCI1410APGE PCI1410APGEG4 PCI1410AGGU
Description PCMCIA BUS CONTROLLER, PBGA209, PLASTIC, BGA-209 PCMCIA BUS CONTROLLER, PQFP144, PLASTIC, LQFP-144 PCMCIA BUS CONTROLLER, PQFP144, PLASTIC, LQFP-144 PCMCIA BUS CONTROLLER, PBGA144, PLASTIC, BGA-144
Is it lead-free? Contains lead Lead free Lead free Contains lead
Maker Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
Parts packaging code BGA QFP QFP BGA
package instruction PLASTIC, BGA-209 LFQFP, LFQFP, PLASTIC, BGA-144
Contacts 209 144 144 144
Reach Compliance Code unknown unknown unknown unknown
Address bus width 32 32 32 32
Bus compatibility PCI PCI PCI PCI
maximum clock frequency 33.33 MHz 33.33 MHz 33.33 MHz 33.33 MHz
External data bus width 32 32 32 32
JESD-30 code S-PBGA-B209 S-PQFP-G144 S-PQFP-G144 S-PBGA-B144
JESD-609 code e0 e4 e4 e0
length 16 mm 20 mm 20 mm 12 mm
Humidity sensitivity level 3 2 2 3
Number of terminals 209 144 144 144
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFQFP LFQFP LFBGA
Package shape SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius) 220 260 260 220
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 1.4 mm 1.6 mm 1.6 mm 1.4 mm
Maximum supply voltage 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage 3 V 3 V 3 V 3 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD TIN LEAD
Terminal form BALL GULL WING GULL WING BALL
Terminal pitch 0.8 mm 0.5 mm 0.5 mm 0.8 mm
Terminal location BOTTOM QUAD QUAD BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 16 mm 20 mm 20 mm 12 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCMCIA BUS CONTROLLER, PCMCIA BUS CONTROLLER, PCMCIA BUS CONTROLLER, PCMCIA

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  2. Application of MAX038 in Precision Frequency Synthesis Waveform Generator
  3. Using Instruments in Multisim
  4. Ultrasonic distance measurement digital tube display
  5. Filter Design with Parasitic Passband Suppression Structure
  6. Design of Intelligent Monitoring System Based on LonWorks
  7. Research on the survivability of WDM mesh networks
  8. FPGA overall video introduction
  9. Temperature characteristics of LDMOS power amplifier and design of temperature compensation circuit
  10. PL2303 Driver

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