80C51BH-1/BQA datasheet, PDF - EEWORLD Datasheet

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80C51BH-1/BQA: DescriptionMicrocontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, CDIP40, CERAMIC, DIP-40; CategoryThe embedded processor and controller Microcontrollers and processors; File Size166KB，6 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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80C51BH-1/BQA Overview

Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, CDIP40, CERAMIC, DIP-40

80C51BH-1/BQA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	DIP
package instruction	CERAMIC, DIP-40
Contacts	40
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Has ADC	NO
Address bus width	16
bit size	8
CPU series	8051
maximum clock frequency	16 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
JESD-30 code	R-GDIP-T40
JESD-609 code	e0
length	52.3875 mm
Number of I/O lines	32
Number of terminals	40
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
PWM channel	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	LCC44,.65SQ
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	128
rom(word)	4096
ROM programmability	MROM
Filter level	38535Q/M;38534H;883B
Maximum seat height	5.588 mm
speed	16 MHz
Maximum slew rate	20 mA
Maximum supply voltage	6 V
Minimum supply voltage	4 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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80C51BH-1/BQA Related Products

	80C51BH-1/BQA	80C31BH/BQA	80C51BH/BQA	80C31BH-1/BQA
Description	Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, CDIP40, CERAMIC, DIP-40	Microcontroller, 8-Bit, 8051 CPU, 12MHz, CMOS, CDIP40, CERAMIC, DIP-40	Microcontroller, 8-Bit, MROM, 8051 CPU, 12MHz, CMOS, CDIP40, CERAMIC, DIP-40	Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, CDIP40, CERAMIC, DIP-40
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	AMD	AMD	AMD	AMD
Parts packaging code	DIP	DIP	DIP	DIP
package instruction	CERAMIC, DIP-40	DIP, LCC44,.65SQ	DIP, LCC44,.65SQ	CERAMIC, DIP-40
Contacts	40	40	40	40
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Has ADC	NO	NO	NO	NO
Address bus width	16	16	16	16
bit size	8	8	8	8
CPU series	8051	8051	8051	8051
maximum clock frequency	16 MHz	12 MHz	12 MHz	16 MHz
DAC channel	NO	NO	NO	NO
DMA channel	NO	NO	NO	NO
External data bus width	8	8	8	8
JESD-30 code	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40	R-GDIP-T40
JESD-609 code	e0	e0	e0	e0
length	52.3875 mm	52.3875 mm	52.3875 mm	52.3875 mm
Number of I/O lines	32	32	32	32
Number of terminals	40	40	40	40
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
PWM channel	NO	NO	NO	NO
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	LCC44,.65SQ	LCC44,.65SQ	LCC44,.65SQ	LCC44,.65SQ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	128	128	128	128
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum seat height	5.588 mm	5.588 mm	5.588 mm	5.588 mm
speed	16 MHz	12 MHz	12 MHz	16 MHz
Maximum slew rate	20 mA	25 mA	25 mA	20 mA
Maximum supply voltage	6 V	6 V	6 V	6 V
Minimum supply voltage	4 V	4 V	4 V	4 V
Nominal supply voltage	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Base Number Matches	-	1	1	1

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