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MX29F400BTC55G

Description
256KX16 FLASH 5V PROM, 55ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48
Categorystorage    storage   
File Size723KB,45 Pages
ManufacturerMacronix
Websitehttp://www.macronix.com/en-us/Pages/default.aspx
Environmental Compliance
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MX29F400BTC55G Overview

256KX16 FLASH 5V PROM, 55ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48

MX29F400BTC55G Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMacronix
Parts packaging codeTSOP1
package instructionTSOP1,
Contacts48
Reach Compliance Codeunknown
Maximum access time55 ns
Other features100,000 MINIMUM ERASE/PROGRAM CYCLES
Spare memory width8
JESD-30 codeR-PDSO-G48
JESD-609 codee6
length18.4 mm
memory density4194304 bit
Memory IC TypeFLASH
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals48
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX16
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Programming voltage5 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTIN BISMUTH
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width12 mm
MX29F400T/B
4M-BIT [512Kx8/256Kx16] CMOS FLASH MEMORY
FEATURES
• 524,288 x 8/262,144 x 16 switchable
• Single power supply operation
- 5.0V only operation for read, erase and program
operation
• Fast access time: 55/70/90/120ns
• Low power consumption
- 40mA maximum active current(5MHz)
- 1uA typical standby current
• Command register architecture
- Byte/word Programming (7us/12us typical)
- Sector Erase (Sector structure 16K-Bytex1, 8K-
Bytex2, 32K-Bytex1, and 64K-Byte x7)
• Auto Erase (chip & sector) and Auto Program
- Automatically erase any combination of sectors with
Erase Suspend capability.
- Automatically program and verify data at specified
address
• Erase suspend/Erase Resume
- Suspends an erase operation to read data from, or
program data to, another sector that is not being
erased, then resumes the erase.
• Status Reply
- Data polling & Toggle bit for detection of program and
erase cycle completion.
Ready/Busy pin (RY/BY)
- Provides a hardware method of detecting program or
erase cycle completion.
- Sector protect/unprotect for 5V only system or 5V/
12V system.
Sector protection
- Hardware method to disable any combination of
sectors from program or erase operations
100,000 minimum erase/program cycles
Latch-up protected to 100mA from -1V to VCC+1V
Boot Code Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
Low VCC write inhibit is equal to or less than 3.2V
Package type:
- 44-pin SOP
- 48-pin TSOP
Compatibility with JEDEC standard
- Pinout and software compatible with single-power
supply Flash
20 years data retention
GENERAL DESCRIPTION
The MX29F400T/B is a 4-mega bit Flash memory orga-
nized as 512K bytes of 8 bits or 256K words of 16 bits.
MXIC's Flash memories offer the most cost-effective
and reliable read/write non-volatile random access
memory. The MX29F400T/B is packaged in 44-pin SOP,
48-pin TSOP. It is designed to be reprogrammed and
erased in system or in standard EPROM programmers.
The standard MX29F400T/B offers access time as fast
as 55ns, allowing operation of high-speed microproces-
sors without wait states. To eliminate bus contention,
the MX29F400T/B has separate chip enable (CE) and
output enable (OE) controls.
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29F400T/B uses a command register to manage this
functionality. The command register allows for 100%
TTL level control inputs and fixed power supply levels
during erase and programming, while maintaining maxi-
mum EPROM compatibility.
MXIC Flash technology reliably stores memory contents
even after 100,000 erase and program cycles. The MXIC
cell is designed to optimize the erase and programming
mechanisms. In addition, the combination of advanced
tunnel oxide processing and low internal electric fields
for erase and program operations produces reliable cy-
cling. The MX29F400T/B uses a 5.0V±10% VCC sup-
ply to perform the High Reliability Erase and auto Pro-
gram/Erase algorithms.
The highest degree of latch-up protection is achieved
with MXIC's proprietary non-epi process. Latch-up pro-
tection is proved for stresses up to 100 milliamps on
address and data pin from -1V to VCC + 1V.
P/N:PM0439
REV. 1.9 , APR. 03, 2002
1

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