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AM29F017B-90F4I

Description
Flash, 2MX8, 90ns, PDSO40, REVERSE, MO-142BCD, TSOP-40
Categorystorage    storage   
File Size924KB,39 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric View All

AM29F017B-90F4I Overview

Flash, 2MX8, 90ns, PDSO40, REVERSE, MO-142BCD, TSOP-40

AM29F017B-90F4I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSPANSION
Parts packaging codeTSOP1
package instructionREVERSE, MO-142BCD, TSOP-40
Contacts40
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time90 ns
command user interfaceYES
Data pollingYES
JESD-30 codeR-PDSO-G40
length18.4 mm
memory density16777216 bit
Memory IC TypeFLASH
memory width8
Humidity sensitivity level1
Number of functions1
Number of departments/size32
Number of terminals40
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1-R
Encapsulate equivalent codeTSSOP40,.8,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
ready/busyYES
reverse pinoutYES
Maximum seat height1.2 mm
Department size64K
Maximum standby current0.000005 A
Maximum slew rate0.04 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width10 mm
Am29F017B
16 Megabit (2 M x 8-Bit)
CMOS 5.0 Volt-only, Uniform Sector Flash Memory
DISTINCTIVE CHARACTERISTICS
s
Optimized for memory card applications
— Backwards-compatible with the Am29F016C
s
5.0 V
±
10%, single power supply operation
— Minimizes system level power requirements
s
Manufactured on 0.32 µm process technology
s
High performance
— Access times as fast as 70 ns
s
Low power consumption
— 25 mA typical active read current
— 30 mA typical program/erase current
— 1 µA typical standby current (standard access
time to active mode)
s
Flexible sector architecture
— 32 uniform sectors of 64 Kbytes each
— Any combination of sectors can be erased.
— Supports full chip erase
— Group sector protection:
A hardware method of locking sector groups to
prevent any program or erase operations within
that sector group
Temporary Sector Group Unprotect allows code
changes in previously locked sectors
s
Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and verifies bytes at specified addresses
s
Minimum 1,000,000 program/erase cycles per
sector guaranteed
s
20-year data retention at 125°C
— Reliable operation for the life of the system
s
Package options
— 40-pin TSOP
— 48-pin TSOP
s
Compatible with JEDEC standards
— Pinout and software compatible with
single-power-supply Flash standard
— Superior inadvertent write protection
s
Data# Polling and toggle bits
— Provides a software method of detecting
program or erase cycle completion
s
Ready/Busy# output (RY/BY#)
— Provides a hardware method for detecting
program or erase cycle completion
s
Erase Suspend/Erase Resume
— Suspends a sector erase operation to read data
from, or program data to, a non-erasing sector,
then resumes the erase operation
s
Hardware reset pin (RESET#)
— Resets internal state machine to the read mode
This Data Sheet states AMD’s current technical specifications regarding the Product described herein. This Data
Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.
Publication#
21195
Rev:
D
Amendment/0
Issue Date:
November 16, 1999
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