Telecom Fuses
www.schurter.com/pg0_3
Surface Mount Fuse, 7.4 x 3.1 mm, Quick-Acting F, Telecom
OSU 25
UL 248-14 · 125 VAC · 125 VDC · Quick-Acting F
Description
Standards
- Directly solderable on printed circuit boards
- Fuseholder available
- UL 248-14
- CSA C22.2 no. 248.14
- Telcordia GR-1089
- UL 60950 / IEC 60950
- ITU-T K.20 and K.21
- TIA-968-A
Applications
References
Weblinks
- xDSL and ADSL linecards and modems
Packaging Details
Corresponding Fuseholder OMH 125
pdf, html, General Product Information, Approvals, RoHS, CHINA-RoHS,
e-Store, SCHURTER-Stock-Check, Distributor-Stock-Check
Approvals
- UL File Number: E41599
- CSA File Number: 51172
Technical Data
Rated Voltage
Rated Current
Breaking Capacity
Characteristic
Mounting
Admissible Ambient Air Temp.
Climatic Category
Material: Housing
Material: Terminals
Unit Weight
Storage Conditions
Product Marking
125 VAC, 125 VDC
0.25 - 3.15 A
100 A
Quick-Acting F
PCB,SMT
-40 °C to 125 °C
40/085/21 acc. to IEC 60068-1
Thermoplastic, UL 94V-0
Tin-Plated Copper Alloy
0.08 g
0 °C to 60 °C, max. 70% r.h.
, Type, Current, Approvals
Soldering Methods
Solderability
Resistance to Soldering Heat
Load Humidity Test
Moisture Resistance Test
Terminal Strength
Case Resistance
Mechanical Shock
Vibration, High Frequency
Reflow, Wave
245 °C / 3 sec acc. to IEC 60068-2-58,
Test Td
260 °C / 10 sec acc. to IEC 60068-2-58,
Test Td
MIL-STD-202, Method 103B
(1000h @ 0.1*In @ 0.85 r.H. @ 85°C)
MIL-STD-202, Method 106E
(50 cycles in a temp./mister chamber)
MIL-STD-202, Method 211A
(Deflection of board 1 mm for 1 minute)
acc. to EIA/IS-722, Test 4.7
>100 MΩ (between leeds and body)
MIL-STD-202, Method 213B
(Shock 50gn, half sine wave, 11 ms)
MIL-STD-202, Method 204D
(Shock 20 gn, 20 min, 10-2 kHz, 12
cyc.)
MIL-STD-202, Method 215A
min. UL 94V-1
(acc. to EIA/IS-722, Test 4.12)
Resistance to Solvents
Flammability
Fuses