MB84VD21091EM-70PBS-E1 datasheet, PDF

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MB84VD21091EM-70PBS-E1: DescriptionMemory Circuit, 1MX16, CMOS, PBGA56, PLASTIC, FBGA-56; Categorystorage storage; File Size923KB，53 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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MB84VD21091EM-70PBS-E1 Overview

Memory Circuit, 1MX16, CMOS, PBGA56, PLASTIC, FBGA-56

MB84VD21091EM-70PBS-E1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	TFBGA,
Contacts	56
Reach Compliance Code	compliant
Other features	SRAM IS ORGANISED AS 128K X 16 OR 256K X 8, FLASH IS ALSO CONFIGURABLE AS 2M X 8
JESD-30 code	R-PBGA-B56
JESD-609 code	e1
length	7.2 mm
memory density	16777216 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Number of functions	1
Number of terminals	56
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	7 mm

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SPANSION MCP

Data Sheet

September 2003

This document specifies SPANSION memory products that are now offered by both Advanced Micro Devices and

Fujitsu. Although the document is marked with the name of the company that originally developed the specification,

these products will be offered to customers of both AMD and Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a SPANSION

revisions will occur when appropriate, and changes will be noted in a revision summary.

product. Future routine

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To order these

products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about SPANSION

solutions.

memory

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Description	Memory Circuit, 1MX16, CMOS, PBGA56, PLASTIC, FBGA-56	Memory Circuit, 1MX16, CMOS, PBGA56, PLASTIC, FBGA-56	Memory Circuit, 1MX16, CMOS, PBGA56, PLASTIC, FBGA-56	Memory Circuit, 1MX16, CMOS, PBGA56, PLASTIC, FBGA-56	Memory Circuit, 1MX16, CMOS, PBGA56, PLASTIC, FBGA-56	Memory Circuit, 1MX16, CMOS, PBGA56, PLASTIC, FBGA-56	Memory Circuit, 1MX16, CMOS, PBGA56, PLASTIC, FBGA-56	Memory Circuit, 1MX16, CMOS, PBGA56, PLASTIC, FBGA-56
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,
Contacts	56	56	56	56	56	56	56	56
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compli
Other features	SRAM IS ORGANISED AS 128K X 16 OR 256K X 8, FLASH IS ALSO CONFIGURABLE AS 2M X 8	SRAM IS ORGANISED AS 128K X 16 OR 256K X 8, FLASH IS ALSO CONFIGURABLE AS 2M X 8	SRAM IS ORGANISED AS 128K X 16 OR 256K X 8, FLASH IS ALSO CONFIGURABLE AS 2M X 8	SRAM IS ORGANISED AS 128K X 16 OR 256K X 8, FLASH IS ALSO CONFIGURABLE AS 2M X 8	SRAM IS ORGANISED AS 128K X 16 OR 256K X 8, FLASH IS ALSO CONFIGURABLE AS 2M X 8	SRAM IS ORGANISED AS 128K X 16 OR 256K X 8, FLASH IS ALSO CONFIGURABLE AS 2M X 8	SRAM IS ORGANISED AS 128K X 16 OR 256K X 8, FLASH IS ALSO CONFIGURABLE AS 2M X 8	SRAM IS ORGANISED AS 128K X 16 OR 256K X 8, FLASH IS ALSO CONFIGURABLE AS 2M X 8
JESD-30 code	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56
JESD-609 code	e1	e1	e1	e1	e1	e1	e1	e1
length	7.2 mm	7.2 mm	7.2 mm	7.2 mm	7.2 mm	7.2 mm	7.2 mm	7.2 mm
memory density	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bi
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	56	56	56	56	56	56	56	56
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16	1MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	40	40	40	40	40	40	40
width	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm
Maker	SPANSION	-	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION	SPANSION

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