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MT4C4256C8/883C

Description
Fast Page DRAM, 256KX4, 80ns, CMOS, CDIP20
Categorystorage    storage   
File Size726KB,11 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Download Datasheet Parametric Compare View All

MT4C4256C8/883C Overview

Fast Page DRAM, 256KX4, 80ns, CMOS, CDIP20

MT4C4256C8/883C Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicron Technology
Reach Compliance Codeunknown
Maximum access time80 ns
I/O typeCOMMON
JESD-30 codeR-XDIP-T20
JESD-609 codee0
memory density1048576 bit
Memory IC TypeFAST PAGE DRAM
memory width4
Number of terminals20
word count262144 words
character code256000
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize256KX4
Output characteristics3-STATE
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP20,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
refresh cycle512
Filter level38535Q/M;38534H;883B
Maximum standby current0.001 A
Maximum slew rate0.07 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

MT4C4256C8/883C Related Products

MT4C4256C8/883C MT4C4256EC10/883C MT4C4256C10/883C
Description Fast Page DRAM, 256KX4, 80ns, CMOS, CDIP20 Fast Page DRAM, 256KX4, 100ns, CMOS, CDSO20 Fast Page DRAM, 256KX4, 100ns, CMOS, CDIP20
Is it Rohs certified? incompatible incompatible incompatible
Maker Micron Technology Micron Technology Micron Technology
Reach Compliance Code unknown not_compliant unknown
Maximum access time 80 ns 100 ns 100 ns
I/O type COMMON COMMON COMMON
JESD-30 code R-XDIP-T20 R-XDSO-N20 R-XDIP-T20
JESD-609 code e0 e0 e0
memory density 1048576 bit 1048576 bit 1048576 bit
Memory IC Type FAST PAGE DRAM FAST PAGE DRAM FAST PAGE DRAM
memory width 4 4 4
Number of terminals 20 20 20
word count 262144 words 262144 words 262144 words
character code 256000 256000 256000
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C
organize 256KX4 256KX4 256KX4
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material CERAMIC CERAMIC CERAMIC
encapsulated code DIP SON DIP
Encapsulate equivalent code DIP20,.3 SOLCC20/26,.35 DIP20,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE IN-LINE
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
refresh cycle 512 512 512
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Maximum standby current 0.001 A 0.001 A 0.001 A
Maximum slew rate 0.07 mA 0.06 mA 0.06 mA
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO YES NO
technology CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE NO LEAD THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL
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