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CD4066BH

Description
SGL POLE SGL THROW SWITCH, UUC, DIE
CategoryAnalog mixed-signal IC    The signal circuit   
File Size276KB,5 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
Download Datasheet Parametric Compare View All

CD4066BH Overview

SGL POLE SGL THROW SWITCH, UUC, DIE

CD4066BH Parametric

Parameter NameAttribute value
MakerRenesas Electronics Corporation
Parts packaging codeDIE
package instruction,
Reach Compliance Codeunknown
Analog Integrated Circuits - Other TypesSPST
JESD-30 codeR-XUUC-N
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formUNCASED CHIP
Certification statusNot Qualified
surface mountYES
Terminal formNO LEAD
Terminal locationUPPER
CD4066B Types
COS/MOS Quad Bilateral
Switch
For Transmission or Multiplexing of Analog or
Digital Signals
Features:
High-Voltage Types (20-Volt Rating)
The RCA-CD40668 IS a quad bilateral SWitch
Intended for the transmission or multiplex-
Ing of analog or digl tal Signals. It is pin-for·
pin compatible with RCA-CD40168, but
exhibits a much lower on-state resistance. In
addition, the on-state resistance IS relatively
constant over the full input-signal range.
The CD40668 consists of four independent
bilateral SWitches. A Single control Signal is
required per SWitch. 80th the p and the n
deVice in a given switch are biased on or
off simultaneously
by the control signal.
As shown in Fig_ 1, the well of the n-channel
deVice on each SWitch IS either tied to the
input when the switch is on or to VSS when
the switch IS off. This configuration elimi-
nates the variation of the SWitch-tranSistor
threshold voltage with input signal, and thus
keeps the on-state resistance low over the full
operating-signal range.
The advantages over Single-channel switches
include peak input-signal voltage swings equal
to the full supply Voltage, and more constant
on-state Impedance over the input-signal
range_ For sample-and-hold applications,
however, the CD40168 IS recommended.
The C04066B is available In 14-lead ceramic
dual-in-line packages (0 and F suffixes).
14-lead plastic dual-in-line packages (E suf-
fix). 14-lead ceramic flat pac;kages (K suffix).
and In chip form (H suffix).
15-V digital or ±7.5-V peak-to-peak switching
• 125n typical on-state resistance for 15-V operation
• Switch on-state resistance matched to within 5 n over
15-V signal-input range
• On-state resistance flat over full peak-to-peak signal
range
• High on/off output-voltage ratio: 80 dB typo
@
fis
=
10 kHz. R L
=
1 kn
• High degree of linearity: <0.5% distortion
FUNCTIONAL DIAGRAM
typo
@
fis
=
1 kHz, Vis
=
5 VP-P. VOO -
VSS
~
10 V, RL
=
10 kn
• Extremely lOw off-state swtch leakage
resulting in very low
offset
current and high
effective off-state resistance: 10 pA typo
@
Applications:
VOO - VSS
=
10 V, TA
=
25
0
C
• Analog signal switching/multiplexing
Signal gating
Modulator
• Extremely high control input impedan.;e
Squelch control
Demodulator
(control circuit isolated from signal cir-
Chopper
Commutating switch
cuit): 10 12 n typo
• Digital signal switching/Multiplexing
• Low crosstalk between switches: -50 dB
typo
@
fis
=
8 MHz, RL
=
1 kn
• Transmission-gate logic implementation
• Matched control-input to signal-output
• Analog-to-digital
&
digital-to-analog
capacitance: Reduces output signal
conversion
transients
• Digital control of frequency, impedance,
• Frequency response, switch on
=
40 MHz
phase, and analog-signal gain
(typ.)
• 100% tested for quiescent current at 20 V
• 5-V, 10-V, and 15-V parametric ratings
• Meets all requirements of JEOEC Tentative
Standard No.13A, "Standard Specifications
for Description of "B" Series CMOS Devices"
MAXIMUM
RATINGS,
Absolute-MaxImum Values
DC SUPPL Y-VOL TAGE RANGE. (VDD'
(Voltages referl!nced to VSS Termlnall
-05 to +20 V
INPUT VOLTAGE RANGE. ALL INPUTS
-05 to V DD +05 V
DC INPUT CURRENT. ANY ONE INPUT (except for
TRANSMIS~I.)N
GATE which IS 25 mAl
±10 mA
POWER DISSIPATION PoER PACKAGE (PO'
For T A : -40 to +60 C IPACKAGE TYPE E)
°
500mW
0
Derate Lln"_ '., at 12 mWI C to 200 mW
For T A : +60 to +85
~
(PACKAGE TYPE E)
(PACKAGE TYPES D. F)
For T A
=
-55 to +100
°
500mW
For T A: +100 to +125 C (PACKAGE TYPES D. F)
Derate Linearly at 12 mWI C to 200 mW
DEVICE DISSIPATION PER OUTPUT TRANSISTOR
FOR TA
=
FULL PACKAGE-TEMPERATURE RANGE (All Package Types)
100mW
OPERATING-TEMPERATURE RANGE (T A)
PACKAGE TYPES 0, F. H
-55 to +125°C
PACKAGE TYPE E
-40 to +85:C
STORAGE TEMPERATURE RANGE (T
st
I
-65 to +150 C
LEAD TEMPERATURE lOURING
SOLD~RINGI
At distance 1/16 ±
1/32
Inch 1159 ± 079 mml from case for 10 s max
f
NORMAL OPERATION
CONTROL-LINE BIASING
SWITCH ON.Vc"-·VDO
SWITCH OFF, VC -0' 'VSS
~~~E·p'SUBSTRATES
CONNECTED TO VDD
g
----
DO
'*ALL CONTROL INPUTS ARE
PROTECTEO BY
COSI
MOS
PROTECTION NETWORK
Vss
RECOMMENDED OPERATING CONDITIONS
For maximum reliability, nominal operating conditions should be selected so that oper-
ation is always within the following ranges:
CHARACTERISTIC
Supply-Voltage Range (For T A
=
Full Package-
Temperature Range)
LIMITS
Min.
Max.
18
UNITS
FIg.
1 -
SchematIC dIagram of
1
of
4
identical
SWItches and its associated control
C/fCUltry.
3
V
218 ____________________________________________________________________________

CD4066BH Related Products

CD4066BH CD4066BE CD4066BK CD4066BF CD4066BD
Description SGL POLE SGL THROW SWITCH, UUC, DIE SGL POLE SGL THROW SWITCH, PDIP14, PLASTIC, DIP-14 CD4066BK CD4066BF CD4066BD
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Parts packaging code DIE DIP DIP DIP DIP
package instruction , DIP, DIP14,.3 CERAMIC, DIP-14 DIP, DIP14,.3 HERMET SEALED, CERAMIC, DIP-14
Reach Compliance Code unknown not_compliant not_compliant not_compliant not_compliant
Analog Integrated Circuits - Other Types SPST SPST SPST SPST SPST
JESD-30 code R-XUUC-N R-PDIP-T14 R-XDFP-F14 R-CDIP-T14 R-CDIP-T14
Package body material UNSPECIFIED PLASTIC/EPOXY CERAMIC CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form UNCASED CHIP IN-LINE FLATPACK IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES NO YES NO NO
Terminal form NO LEAD THROUGH-HOLE FLAT THROUGH-HOLE THROUGH-HOLE
Terminal location UPPER DUAL DUAL DUAL DUAL
Is it Rohs certified? - incompatible incompatible incompatible incompatible
Contacts - 14 14 14 14
JESD-609 code - e0 e0 e0 e0
normal position - NO NO NO NO
Number of functions - 4 4 4 4
Number of terminals - 14 14 14 14
Maximum on-state resistance (Ron) - 1200 Ω 1300 Ω 1300 Ω 1300 Ω
Maximum operating temperature - 85 °C 125 °C 125 °C 125 °C
Minimum operating temperature - -40 °C -55 °C -55 °C -55 °C
output - SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT
encapsulated code - DIP DFP DIP DIP
Encapsulate equivalent code - DIP14,.3 FL14,.3 DIP14,.3 DIP14,.3
Peak Reflow Temperature (Celsius) - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
power supply - 5/15 V 5/15 V 5/15 V 5/15 V
Maximum seat height - 5.33 mm - 5.08 mm 5.08 mm
Maximum connection time - 70 ns 70 ns 70 ns 70 ns
technology - CMOS CMOS CMOS CMOS
Temperature level - INDUSTRIAL MILITARY MILITARY MILITARY
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal pitch - 2.54 mm 1.27 mm 2.54 mm 2.54 mm
Maximum time at peak reflow temperature - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width - 7.62 mm - 7.62 mm 7.62 mm

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