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FM27LV512T150L

Description
OTP ROM, 64KX8, 150ns, CMOS, PDSO28, PLASTIC, TSOP1-28
Categorystorage    storage   
File Size313KB,11 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Download Datasheet Parametric Compare View All

FM27LV512T150L Overview

OTP ROM, 64KX8, 150ns, CMOS, PDSO28, PLASTIC, TSOP1-28

FM27LV512T150L Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerFairchild
Parts packaging codeTSOP
package instructionTSOP1, TSSOP28,.53,22
Contacts28
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time150 ns
Other featuresTTL/CMOS COMPATIBLE INPUTS/OUTPUTS
I/O typeCOMMON
JESD-30 codeR-PDSO-G28
JESD-609 codee0
length11.8 mm
memory density524288 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals28
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Encapsulate equivalent codeTSSOP28,.53,22
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum standby current0.00001 A
Maximum slew rate0.015 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.55 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
This Material Copyrighted By Its Respective Manufacturer

FM27LV512T150L Related Products

FM27LV512T150L FM27LV512TE150L FM27LV512N150L FM27LV512NE150L FM27LV512V150L FM27LV512VE150L
Description OTP ROM, 64KX8, 150ns, CMOS, PDSO28, PLASTIC, TSOP1-28 OTP ROM, 64KX8, 150ns, CMOS, PDSO28, PLASTIC, TSOP1-28 OTP ROM, 64KX8, 150ns, CMOS, PDIP28, PLASTIC, DIP-28 OTP ROM, 64KX8, 150ns, CMOS, PDIP28, PLASTIC, DIP-28 OTP ROM, 64KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 64KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild
Parts packaging code TSOP TSOP DIP DIP QFJ QFJ
package instruction TSOP1, TSSOP28,.53,22 TSOP1, TSSOP28,.53,22 DIP, DIP28,.6 DIP, DIP28,.6 QCCJ, LDCC32,.5X.6 QCCJ, LDCC32,.5X.6
Contacts 28 28 28 28 32 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 150 ns 150 ns 150 ns 150 ns 150 ns 150 ns
Other features TTL/CMOS COMPATIBLE INPUTS/OUTPUTS TTL/CMOS COMPATIBLE INPUTS/OUTPUTS TTL/CMOS COMPATIBLE INPUTS/OUTPUTS TTL/CMOS COMPATIBLE INPUTS/OUTPUTS TTL/CMOS COMPATIBLE INPUTS/OUTPUTS TTL/CMOS COMPATIBLE INPUTS/OUTPUTS
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDSO-G28 R-PDSO-G28 R-PDIP-T28 R-PDIP-T28 R-PQCC-J32 R-PQCC-J32
JESD-609 code e0 e0 e0 e0 e0 e0
length 11.8 mm 11.8 mm 35.942 mm 35.942 mm 13.995 mm 13.995 mm
memory density 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 28 28 28 28 32 32
word count 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000 64000 64000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 70 °C 85 °C 70 °C 85 °C
organize 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 TSOP1 DIP DIP QCCJ QCCJ
Encapsulate equivalent code TSSOP28,.53,22 TSSOP28,.53,22 DIP28,.6 DIP28,.6 LDCC32,.5X.6 LDCC32,.5X.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE IN-LINE IN-LINE CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 5.334 mm 5.334 mm 3.56 mm 3.56 mm
Maximum standby current 0.00001 A 0.00001 A 0.00001 A 0.00001 A 0.00001 A 0.00001 A
Maximum slew rate 0.015 mA 0.015 mA 0.015 mA 0.015 mA 0.015 mA 0.015 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES NO NO YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE J BEND J BEND
Terminal pitch 0.55 mm 0.55 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 8 mm 8 mm 15.24 mm 15.24 mm 11.455 mm 11.455 mm
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