EEWORLDEEWORLDEEWORLD

Part Number

Search

FM27LV512V150L

Description
OTP ROM, 64KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32
Categorystorage    storage   
File Size313KB,11 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Download Datasheet Parametric Compare View All

FM27LV512V150L Overview

OTP ROM, 64KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32

FM27LV512V150L Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerFairchild
Parts packaging codeQFJ
package instructionQCCJ, LDCC32,.5X.6
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time150 ns
Other featuresTTL/CMOS COMPATIBLE INPUTS/OUTPUTS
I/O typeCOMMON
JESD-30 codeR-PQCC-J32
JESD-609 codee0
length13.995 mm
memory density524288 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals32
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize64KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC32,.5X.6
Package shapeRECTANGULAR
Package formCHIP CARRIER
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum seat height3.56 mm
Maximum standby current0.00001 A
Maximum slew rate0.015 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.455 mm
This Material Copyrighted By Its Respective Manufacturer

FM27LV512V150L Related Products

FM27LV512V150L FM27LV512TE150L FM27LV512N150L FM27LV512NE150L FM27LV512T150L FM27LV512VE150L
Description OTP ROM, 64KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 OTP ROM, 64KX8, 150ns, CMOS, PDSO28, PLASTIC, TSOP1-28 OTP ROM, 64KX8, 150ns, CMOS, PDIP28, PLASTIC, DIP-28 OTP ROM, 64KX8, 150ns, CMOS, PDIP28, PLASTIC, DIP-28 OTP ROM, 64KX8, 150ns, CMOS, PDSO28, PLASTIC, TSOP1-28 OTP ROM, 64KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Fairchild Fairchild Fairchild Fairchild Fairchild Fairchild
Parts packaging code QFJ TSOP DIP DIP TSOP QFJ
package instruction QCCJ, LDCC32,.5X.6 TSOP1, TSSOP28,.53,22 DIP, DIP28,.6 DIP, DIP28,.6 TSOP1, TSSOP28,.53,22 QCCJ, LDCC32,.5X.6
Contacts 32 28 28 28 28 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 150 ns 150 ns 150 ns 150 ns 150 ns 150 ns
Other features TTL/CMOS COMPATIBLE INPUTS/OUTPUTS TTL/CMOS COMPATIBLE INPUTS/OUTPUTS TTL/CMOS COMPATIBLE INPUTS/OUTPUTS TTL/CMOS COMPATIBLE INPUTS/OUTPUTS TTL/CMOS COMPATIBLE INPUTS/OUTPUTS TTL/CMOS COMPATIBLE INPUTS/OUTPUTS
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PQCC-J32 R-PDSO-G28 R-PDIP-T28 R-PDIP-T28 R-PDSO-G28 R-PQCC-J32
JESD-609 code e0 e0 e0 e0 e0 e0
length 13.995 mm 11.8 mm 35.942 mm 35.942 mm 11.8 mm 13.995 mm
memory density 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1
Number of terminals 32 28 28 28 28 32
word count 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000 64000 64000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 85 °C 70 °C 85 °C 70 °C 85 °C
organize 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ TSOP1 DIP DIP TSOP1 QCCJ
Encapsulate equivalent code LDCC32,.5X.6 TSSOP28,.53,22 DIP28,.6 DIP28,.6 TSSOP28,.53,22 LDCC32,.5X.6
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER SMALL OUTLINE, THIN PROFILE IN-LINE IN-LINE SMALL OUTLINE, THIN PROFILE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.56 mm 1.2 mm 5.334 mm 5.334 mm 1.2 mm 3.56 mm
Maximum standby current 0.00001 A 0.00001 A 0.00001 A 0.00001 A 0.00001 A 0.00001 A
Maximum slew rate 0.015 mA 0.015 mA 0.015 mA 0.015 mA 0.015 mA 0.015 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES NO NO YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING J BEND
Terminal pitch 1.27 mm 0.55 mm 2.54 mm 2.54 mm 0.55 mm 1.27 mm
Terminal location QUAD DUAL DUAL DUAL DUAL QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 11.455 mm 8 mm 15.24 mm 15.24 mm 8 mm 11.455 mm
ADP1055 digital controller for power supply applications with PMBus interface
The ADP1055 is a flexible, feature-rich digital secondary-side controller for AC-DC and isolated DC-DC secondary-side applications. The ADP1055 is also optimized for minimum component count, maximum f...
dontium ADI Reference Circuit
Play games, experience EasyPower, and win a TI handheld POS development kit worth 800 yuan!
After experiencing Easy Power Supply, I suddenly found that circuits can be learned in this way. It is quite interesting. However, I still like to make the actual circuit. Isn’t it more intuitive?...
lh498136502 Analogue and Mixed Signal
Ethernet communication module debugging problem help
There are two communication modules, one is CAN to Ethernet, the other is Ethernet to 232. Both modules can communicate individually, but they cannot communicate with each other. Please help. The CAN ...
烽火 Integrated technical exchanges
Design of TPS53355 ripple injection circuit
Frank Xiao As a representative chip of D-CAP mode, TPS53355 has excellent load dynamic response performance and very simple external circuit design requirements. It is widely used in products such as ...
alan000345 Analogue and Mixed Signal
Is there a capacitance measurement circuit?
How can I not find it when I'm hungry?...
linbo411 MCU
TI trip to the United States--Day 1
[i=s] This post was last edited by paulhyde on 2014-9-15 03:37 [/i] [font=微软雅黑][color=rgb(0,0,0)] After enjoying the sumptuous breakfast at the WESTIN Hotel, we came to the Dallas headquarters of TI, ...
luo394602370 Electronics Design Contest

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1051  1402  175  587  2395  22  29  4  12  49 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号