FM27LV512TE150L datasheet, PDF

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FM27LV512TE150L: DescriptionOTP ROM, 64KX8, 150ns, CMOS, PDSO28, PLASTIC, TSOP1-28; Categorystorage storage; File Size313KB，11 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/

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FM27LV512TE150L Overview

OTP ROM, 64KX8, 150ns, CMOS, PDSO28, PLASTIC, TSOP1-28

FM27LV512TE150L Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Fairchild
Parts packaging code	TSOP
package instruction	TSOP1, TSSOP28,.53,22
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	150 ns
Other features	TTL/CMOS COMPATIBLE INPUTS/OUTPUTS
I/O type	COMMON
JESD-30 code	R-PDSO-G28
JESD-609 code	e0
length	11.8 mm
memory density	524288 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	28
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP1
Encapsulate equivalent code	TSSOP28,.53,22
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.00001 A
Maximum slew rate	0.015 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.55 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8 mm

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FM27LV512TE150L Related Products

	FM27LV512TE150L	FM27LV512N150L	FM27LV512NE150L	FM27LV512T150L	FM27LV512V150L	FM27LV512VE150L
Description	OTP ROM, 64KX8, 150ns, CMOS, PDSO28, PLASTIC, TSOP1-28	OTP ROM, 64KX8, 150ns, CMOS, PDIP28, PLASTIC, DIP-28	OTP ROM, 64KX8, 150ns, CMOS, PDIP28, PLASTIC, DIP-28	OTP ROM, 64KX8, 150ns, CMOS, PDSO28, PLASTIC, TSOP1-28	OTP ROM, 64KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 64KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Fairchild	Fairchild	Fairchild	Fairchild	Fairchild	Fairchild
Parts packaging code	TSOP	DIP	DIP	TSOP	QFJ	QFJ
package instruction	TSOP1, TSSOP28,.53,22	DIP, DIP28,.6	DIP, DIP28,.6	TSOP1, TSSOP28,.53,22	QCCJ, LDCC32,.5X.6	QCCJ, LDCC32,.5X.6
Contacts	28	28	28	28	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	150 ns	150 ns	150 ns	150 ns	150 ns	150 ns
Other features	TTL/CMOS COMPATIBLE INPUTS/OUTPUTS	TTL/CMOS COMPATIBLE INPUTS/OUTPUTS	TTL/CMOS COMPATIBLE INPUTS/OUTPUTS	TTL/CMOS COMPATIBLE INPUTS/OUTPUTS	TTL/CMOS COMPATIBLE INPUTS/OUTPUTS	TTL/CMOS COMPATIBLE INPUTS/OUTPUTS
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDSO-G28	R-PDIP-T28	R-PDIP-T28	R-PDSO-G28	R-PQCC-J32	R-PQCC-J32
JESD-609 code	e0	e0	e0	e0	e0	e0
length	11.8 mm	35.942 mm	35.942 mm	11.8 mm	13.995 mm	13.995 mm
memory density	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	28	28	28	28	32	32
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C	70 °C	85 °C
organize	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP1	DIP	DIP	TSOP1	QCCJ	QCCJ
Encapsulate equivalent code	TSSOP28,.53,22	DIP28,.6	DIP28,.6	TSSOP28,.53,22	LDCC32,.5X.6	LDCC32,.5X.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	IN-LINE	IN-LINE	SMALL OUTLINE, THIN PROFILE	CHIP CARRIER	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	5.334 mm	5.334 mm	1.2 mm	3.56 mm	3.56 mm
Maximum standby current	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A	0.00001 A
Maximum slew rate	0.015 mA	0.015 mA	0.015 mA	0.015 mA	0.015 mA	0.015 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	NO	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	THROUGH-HOLE	THROUGH-HOLE	GULL WING	J BEND	J BEND
Terminal pitch	0.55 mm	2.54 mm	2.54 mm	0.55 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	8 mm	15.24 mm	15.24 mm	8 mm	11.455 mm	11.455 mm

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